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Heterogeneous Advancement and hybrid integration of polymer and tripLEx platform for Integrated Microwave PhoTonics

Objective

Microwave photonics technology (MWP) has the potential to create a huge commercial impact by bringing together the worlds of microwave engineering and photonics and by enabling processing functionalities in microwave systems that are complex or totally impossible in the microwave domain. The main reason for not having achieved this so far has been the lack of a photonic integration technology that could address the specific needs of MWP. HAMLET aims to fill this gap and develop a disruptive photonic integration platform that will enable the development of very large scale photonic integrated circuits (VLSPICs) with cascaded stages of tunable structures for analog and digital signal processing, variety of optical processing functionalities and ultra-low optical loss. To this end, HAMLET will employ two integration levels. At the first one, it will develop a disruptive PZT-based phase-shifter technology on TriPleX platform with lower power consumption compared to thermal phase-shifters by almost one million times. At the same level HAMLET will incorporate the deposition of graphene films as a standard step in the fabrication process of polymer platform and will develop arrays of electro-absorption modulators with high bandwidth (>25 GHz). At the second integration level, HAMLET will bring together the two platforms
under a 3D hybrid integration engine, and will develop circuits with record scale of integrated components (>300), record scale of functionalities with optical beamforming for 64-element antenna arrays at first place, and novel use as the interface between the wireless and the optical part at the antenna units of emerging 5G networks. Finally, in parallel with the system-related exploitation, HAMLET will also work on the unification of the two platforms under a multi-project wafer run type of services to external users, where the 3D integration engine will be used for provision of supersets of components and tools already available in the two platforms.

Call for proposal

H2020-ICT-2015
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Coordinator

INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS
Address
Patission Str. 42
10682 Athina
Greece
Activity type
Research Organisations
EU contribution
€ 520 000

Participants (5)

LIONIX INTERNATIONAL BV
Netherlands
EU contribution
€ 765 031,25
Address
Hengelosestraat 500
7521 AN Enschede
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany
EU contribution
€ 826 983,75
Address
Hansastrasse 27C
80686 Munchen
Activity type
Research Organisations
SOLMATES BV
Netherlands
EU contribution
€ 877 500
Address
Auke Vleerstraat 3
7521 PE Enschede
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Linkra S.R.L.

Participation ended

Italy
EU contribution
€ 0
Address
Via Guido Rossa 20/22
20040 Cornate D'adda
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
CORDON ELECTRONICS ITALIA SRL
Italy
EU contribution
€ 497 886,25
Address
Via Guido Rossa 22
20872 Cornate D'adda
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)