Periodic Reporting for period 3 - IoSense (Flexible FE/BE Sensor Pilot Line for the Internet of Everything)
Reporting period: 2018-05-01 to 2019-04-30
Aim of IoSense was to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establishing three fully connected semiconductor pilot lines in Europe: two 200mm frontend (Dresden, Regensburg) and one backend (Regensburg); networking with existing highly specialized manufacturing lines. Focus was on the availability of top innovative, competitive sensors and sensor systems “Made in Europe” for applications in Smart Mobility, Society, Energy, Health and Production.
The work of the involved partners was guided by overall objectives, which were achieved during the project lifetime.
Project Objectives:
Objective 1: Boost the effectiveness and the efficiency of existing volume manufacturing lines by creating a network of three qualified, fully connected and collaborating pilot lines for both discrete and integrated innovative sensor systems.
Objective 2: Establish the new pilot line supply chain as key element of an IoT value creating network for the efficient innovation in technologies, sensors, sensor components and IoT products in Europe.
Objective 3: Provide innovative sensor product design.
Objective 4: Provide FE and BE sensor technologies for both discrete and integrated innovative sensor devices, suitable for high volume production.
Objective 5: Provide electrical, mechanical, security and software resources for integration of sensor system components into IoT systems and IoT enabling systems.
Objective 6: Demonstrate IoT sensor system reliability.
Objective 7: Demonstrate advanced next generation connectable sensor systems for IoT and achieve benchmark performance regarding size, cost, idea-to-market for sensors and sensor systems to serve the use cases defined.
The key objective of the project was achieved: the base for increased manufacturing capacity for discrete and integrated sensors and sensor system solutions in Europe, including design development and test for different key application oriented supply chains, was established.
The work of the involved partners was guided by overall objectives, which were achieved during the project lifetime.
Project Objectives:
Objective 1: Boost the effectiveness and the efficiency of existing volume manufacturing lines by creating a network of three qualified, fully connected and collaborating pilot lines for both discrete and integrated innovative sensor systems.
Objective 2: Establish the new pilot line supply chain as key element of an IoT value creating network for the efficient innovation in technologies, sensors, sensor components and IoT products in Europe.
Objective 3: Provide innovative sensor product design.
Objective 4: Provide FE and BE sensor technologies for both discrete and integrated innovative sensor devices, suitable for high volume production.
Objective 5: Provide electrical, mechanical, security and software resources for integration of sensor system components into IoT systems and IoT enabling systems.
Objective 6: Demonstrate IoT sensor system reliability.
Objective 7: Demonstrate advanced next generation connectable sensor systems for IoT and achieve benchmark performance regarding size, cost, idea-to-market for sensors and sensor systems to serve the use cases defined.
The key objective of the project was achieved: the base for increased manufacturing capacity for discrete and integrated sensors and sensor system solutions in Europe, including design development and test for different key application oriented supply chains, was established.
The project was progressing according to plan, all deliverables were completed and all milestones achieved. Efficient and effective project management structures as well as communication processes were in place. Key bodies like the Project Management Team and Technical Steering Board were working according to the roadmaps. The Exploitation and Innovation Manager together with the IoSense Advisory Board supported the consortium. The Consortium has demonstrated close and effective collaborations, communication and follow-up strategies along vertical structures in work packages and on task level as well as horizontal structures within demonstrator communities.
WP1 towards project objective 2: Specifications and requirements definitions of integrated sensor network solution demonstrators and stand-alone sensor sub-system demonstrators were successfully completed. Interfaces and hand-overs to the other work packages were defined, supply chains described.
WP2 towards project objective 3: Concept and design of the highly competitive sensor and sensor system components in IoSense using adequate simulation methodologies applied in the IoSense demonstrators were successfully completed. The competitiveness was measured by defining figures for the top ten measurable key competitiveness indicators depending on use case and market conditions. Test vehicles and prototypes for the pilot line were developed.
WP3 towards project objective 4: FE technologies and feasibility for integrated or integratable and discrete sensor devises were successfully provided including demonstration of the sensor device or system-on-silicon feasibility and the delivery of hardware components (FE manufactures and tested). 11 highly innovative sensor devices were brought to TRLs 4-9 (pressure, LiDAR, gas, magnetic, ToF, MEMS microphone, fine dust, and spectrometer). The FE technologies were integrated into the supply chain of the pilot lines.
WP4 towards project objective 4: Backend and packaging technologies for discrete and integrated innovative sensors were successfully provided and applied in the backend pilot lines. Novel or adapted packaging approaches were investigated and associated processes developed. Test vehicles were defined to demonstrate the package concepts. Concept and unit process step development for advanced multi-chip packaging approaches were completed. Flexible 3D integration solutions were developed.
WP5 towards project objective 5: System integration on electrical and mechanical level was successfully implemented focusing on IoT systems and IoT-enabling system to allow delivering top performance. Aspects such as system security, runtime requirement and related system performance optimization were covered. Software tool kit development and compilation were completed to ease the adoption of IoSense developments by new users.
WP6 towards project objective 1: A European network of pilot lines was established including high-volume pilot lines and associated low-volume R&D pilot lines on wafer level (FE) as well as assembly and packaging (BE). Novel processes and concepts were implemented regarding materials, technology and process development, manufacturing and processing, equipment aspects, characterization of prototypes and line validation.
WP7 towards project objective 7: To demonstrate and leverage the power of the IoSense pilot lines 7 integrated sensor network solution demonstrators and 2 stand-alone sub-system demonstrators were successfully presented covering the MASP domains Smart System Integration, Smart Society and Health, Smart Energy, Smart Mobility and Smart Production. Furthermore the IoT sensor system reliability was assured by tests considering thermal, mechanical, thermos-mechanical and chemical effects including virtual techniques for reliability assessment.
Dissemination: The results of the IoSense project were disseminated in close to 100 publications. The partners participated in many conferences, exhibitions and workshops. Two spring schools were organized. IoSense published the book “Sensor Systems Simulations: From Concept to Solution”. The dissemination infrastructure was enhanced by the project website, newsletter, IoSense Network (LINC) and the IoSense Club.
WP1 towards project objective 2: Specifications and requirements definitions of integrated sensor network solution demonstrators and stand-alone sensor sub-system demonstrators were successfully completed. Interfaces and hand-overs to the other work packages were defined, supply chains described.
WP2 towards project objective 3: Concept and design of the highly competitive sensor and sensor system components in IoSense using adequate simulation methodologies applied in the IoSense demonstrators were successfully completed. The competitiveness was measured by defining figures for the top ten measurable key competitiveness indicators depending on use case and market conditions. Test vehicles and prototypes for the pilot line were developed.
WP3 towards project objective 4: FE technologies and feasibility for integrated or integratable and discrete sensor devises were successfully provided including demonstration of the sensor device or system-on-silicon feasibility and the delivery of hardware components (FE manufactures and tested). 11 highly innovative sensor devices were brought to TRLs 4-9 (pressure, LiDAR, gas, magnetic, ToF, MEMS microphone, fine dust, and spectrometer). The FE technologies were integrated into the supply chain of the pilot lines.
WP4 towards project objective 4: Backend and packaging technologies for discrete and integrated innovative sensors were successfully provided and applied in the backend pilot lines. Novel or adapted packaging approaches were investigated and associated processes developed. Test vehicles were defined to demonstrate the package concepts. Concept and unit process step development for advanced multi-chip packaging approaches were completed. Flexible 3D integration solutions were developed.
WP5 towards project objective 5: System integration on electrical and mechanical level was successfully implemented focusing on IoT systems and IoT-enabling system to allow delivering top performance. Aspects such as system security, runtime requirement and related system performance optimization were covered. Software tool kit development and compilation were completed to ease the adoption of IoSense developments by new users.
WP6 towards project objective 1: A European network of pilot lines was established including high-volume pilot lines and associated low-volume R&D pilot lines on wafer level (FE) as well as assembly and packaging (BE). Novel processes and concepts were implemented regarding materials, technology and process development, manufacturing and processing, equipment aspects, characterization of prototypes and line validation.
WP7 towards project objective 7: To demonstrate and leverage the power of the IoSense pilot lines 7 integrated sensor network solution demonstrators and 2 stand-alone sub-system demonstrators were successfully presented covering the MASP domains Smart System Integration, Smart Society and Health, Smart Energy, Smart Mobility and Smart Production. Furthermore the IoT sensor system reliability was assured by tests considering thermal, mechanical, thermos-mechanical and chemical effects including virtual techniques for reliability assessment.
Dissemination: The results of the IoSense project were disseminated in close to 100 publications. The partners participated in many conferences, exhibitions and workshops. Two spring schools were organized. IoSense published the book “Sensor Systems Simulations: From Concept to Solution”. The dissemination infrastructure was enhanced by the project website, newsletter, IoSense Network (LINC) and the IoSense Club.
A continuous competitor analysis assessing the relative status of development and of the competition vs. market requirements showed that for all sensor types addressed in IoSense at least one of the features performance/system cost/form factor competitiveness is evident.
Socio-economic impact: Impact of IoSense is to support keeping the pace in sensor component innovation in order to ensure that sensor component manufacturing in Europe will be in a leading position in 2020 and beyond. IoSense was focusing on sensor solutions as components and sub-systems in the key application domains Smart Mobility, Society, Energy, Health and Production. They enable a multitude of upcoming innovative IoT solutions in order to address the Grand Societal challenges for 2020 and beyond.
Socio-economic impact: Impact of IoSense is to support keeping the pace in sensor component innovation in order to ensure that sensor component manufacturing in Europe will be in a leading position in 2020 and beyond. IoSense was focusing on sensor solutions as components and sub-systems in the key application domains Smart Mobility, Society, Energy, Health and Production. They enable a multitude of upcoming innovative IoT solutions in order to address the Grand Societal challenges for 2020 and beyond.