Objective HIOS (“Highly Integrated Optoelectronic Sensor”) aims to develop and to launch world’s first light sensor with fully integrated optical stack. The fully integrated optically stack technology which will be developed in HIOS project will be the technology enabler which brings the highly integrated optoelectronic sensor to the market. The sensors which will be enabled in the first step are single band and multi band light sensors, namely Ambient Light Sensor and derivate such as UV Sensor & Color Sensor. Three main markets which will be addressed are the Wearable, Low Cost Consumer (smart phones, cellular) & Smart Lighting Market.ams already offers prior art TSL2584TSV which is industry’s first ambient light sensor with 3D/TSV and single filter integrated at wafer level. In HIOS project the consortium wants to move one step further to ensure also the future competitiveness and keep the market leadership in Europe. HIOS project wants to integrate the full optical stacks including multiple filters, lenses and apertures for the first time and wants to provide a high volume production environment for 3D/TSV + Filters + Wafer Level Package. The main technical innovations will be Filter tool and processes developed to achieve industry’s tightest filter specifications, Wafer Level Molding tool modified by adding new alignment system to achieve, novel patented lense design and wafer level mold process, filters, lenses and apertures integrated at Wafer Level for the first time and industry’s lowest alignment tolerances as required by the applications. The expected outcomes are a Single band and multi-band light sensors – smallest size and lowest system cost at best optical performance (ambient light sensor and derivatives such as color sensor and UV sensor) and an Equipment which enabling this new application and many other applications; WLM- tightest overlay control; Filter – tightest pass band width control; low stress filter deposition to enable multiple filters. Fields of science natural sciencesphysical scienceselectromagnetism and electronicsoptoelectronicsengineering and technologymaterials engineeringcolorsengineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsoptical sensorsengineering and technologymaterials engineeringcoating and filmsengineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringcontrol systemshome automation Programme(s) H2020-EC - Horizon 2020 Framework Programme Main Programme H2020-EU.3. - PRIORITY 'Societal challenges H2020-EU.2. - PRIORITY 'Industrial leadership' Topic(s) FTIPilot-1-2015 - Fast Track to Innovation Pilot Call for proposal H2020-FTIPilot-2015-1 See other projects for this call Funding Scheme IA - Innovation action Coordinator AMS-OSRAM AG Net EU contribution € 1 471 341,38 Address Tobelbaderstrasse 30 schloss premstatten 8141 Unterpremstatten Austria See on map Region Südösterreich Steiermark Graz Activity type Private for-profit entities (excluding Higher or Secondary Education Establishments) Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Other funding € 630 574,87 Participants (3) Sort alphabetically Sort by Net EU contribution Expand all Collapse all BUHLER ALZENAU GMBH Germany Net EU contribution € 770 000,00 Address Siemensstrasse 88 63755 Alzenau See on map Region Bayern Unterfranken Aschaffenburg, Landkreis Activity type Private for-profit entities (excluding Higher or Secondary Education Establishments) Links Contact the organisation Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Other funding € 330 000,00 BOSCHMAN TECHNOLOGIES BV Netherlands Net EU contribution € 489 825,00 Address Stenograaf 3 6921 EX Duiven See on map SME The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed. Yes Region Oost-Nederland Gelderland Arnhem/Nijmegen Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Other funding € 209 925,00 ADVANCED PACKAGING CENTER BV Netherlands Net EU contribution € 266 612,50 Address Stenograaf 3 6921 EX Duiven See on map SME The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed. Yes Region Oost-Nederland Gelderland Arnhem/Nijmegen Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Other funding € 114 262,50
