Periodic Reporting for period 3 - PINQS (Photonic integrated quantum transceivers)
Reporting period: 2020-05-01 to 2021-10-31
Quantum processors are envisioned to conquer ultimate challenges in information processing and to enable simulations of complex physical processes that are intractable with classical computers. Among the various experimental approaches to implement such devices, scalable technologies are particularly promising because they allow for the realization of large numbers of quantum components in circuit form. For upscaling towards functional applications distributed systems will be needed to overcome stringent limitations in quantum control, provided that high-bandwidth quantum links can be established between the individual nodes. For this purpose, the use of single photons is especially attractive due to compatibility with existing fibre-optical infrastructure. However, their use in replicable, integrated optical circuits remains largely unexplored for non-classical applications.
In this project nanophotonic circuits, heterogeneously integrated with superconducting nanostructures and carbon nanotubes, will be used to realize scalable quantum photonic chips that overcome major barriers in linear quantum optics and quantum communication. By relying on electro-optomechanical and electro-optical interactions, reconfigurable single photon transceivers will be devised that can act as broadband and high bandwidth nodes in future quantum optical networks. A hybrid integration approach will allow for the realization of fully functional quantum photonic modules which are interconnected with optical fiber links. By implementing quantum wavelength division multiplexing, the communication rates between individual transceiver nodes will be boosted by orders of magnitude, thus allowing for high-speed and remote quantum information processing and quantum simulation. Further exploiting recent advances in three-dimensional distributed nanophotonics will lead to a paradigm shift in nanoscale quantum optics, providing a key step towards optical quantum computing and the quantum internet.
In this project nanophotonic circuits, heterogeneously integrated with superconducting nanostructures and carbon nanotubes, will be used to realize scalable quantum photonic chips that overcome major barriers in linear quantum optics and quantum communication. By relying on electro-optomechanical and electro-optical interactions, reconfigurable single photon transceivers will be devised that can act as broadband and high bandwidth nodes in future quantum optical networks. A hybrid integration approach will allow for the realization of fully functional quantum photonic modules which are interconnected with optical fiber links. By implementing quantum wavelength division multiplexing, the communication rates between individual transceiver nodes will be boosted by orders of magnitude, thus allowing for high-speed and remote quantum information processing and quantum simulation. Further exploiting recent advances in three-dimensional distributed nanophotonics will lead to a paradigm shift in nanoscale quantum optics, providing a key step towards optical quantum computing and the quantum internet.
During the first funding period the technological and scientific foundations for heterogeneous integration of quantum photonic devices have been laid. With respect to scalable implementation of quantum photonic integrated circuits fabrication routines for creating multi-device architectures with high yield have been developed. This includes in particular the development of high efficiency and compact single photon detectors that interface well with waveguide devices. Similarly, integrated single photon emitters that are integratable with nanophotonic waveguides have been developed. In order to enable seamless interfacing between different material platforms and device geometries, hybrid planar-3D nanofabrication has been implemented. This way high yield manufacture of complex circuit architectures has been achieved.
Building on the successful realization of functional elements for quantum photonic integrated circuits, in the second half of the project the realization of full circuit devices will be the research focus. Using scalable integration techniques, waveguide coupling of multi-device architectures will be used to implement chip-based quantum simulation devices as well as quantum communication modules. Relying on the advanced fabrication and integration techniques developed in the first funding period will enable interconnecting large component ensembles into functional prototypes.