Periodic Reporting for period 2 - G-IMAGER (New Graphene Imager based on Graphene-on-wafer)
Reporting period: 2019-09-01 to 2021-02-28
The idea was to combine graphene, a newly discovered nanomaterial, with photosensitive materials and integrate them with existing electronic platforms (CMOS technology) in order to build the core of the cameras.
Graphenea optimized the graphene synthesis and transfer processes in order to achieve a high throughput with the required specifications for the imager product on 200mm wafers.
AMO mainly worked on the process development and validation of the graphene based IR imager. The process has been scaled up to 200 mm wafer size with a well-defined design rule and basic modules. The integration of graphene based FET on ASIC wafer has also been demonstrated with functional devices.
Emberion developed the photosensitive absorber stack on 200mm ASIC wafers, along with a semiconductor hermetic package to protect the sensor die from water and oxygen. Emberion designed the custom readout integrated circuit (ROIC) used in device readout and has integrated the packaged sensor dies into a camera core, which was then been used to create a full camera. Evaluation versions of the camera have been sold to a number of customers and the first shipments are planned in Q5.