Pioneering carbon nanotube cooling technology unleashes processing power
Electronics dissipate energy as heat, and heat damages electronics; therefore, cooling systems are critical to performance and stability. Currently, heat pipes are the preferred cooling technology for mobile devices. Heat pipes are small-diameter pipes for high-efficiency, passive and compact heat transfer over a relatively large surface, allowing low heat flux to dissipate through the device cover to ambient air. Heat pipe cooling technology has not changed much in recent decades, and an update is needed to unleash the full power of modern processors. The EU-funded HEAT project is developing high-tech foams made of carbon nanotube composites processed with innovative technology to control pore size and thermal conductivity.
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