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Reliable Electronics for Tomorrow’s Active Systems

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Failure patterns of solder joints identified throughlifetime vibration tests

Author(s): Kangkana Baishya, David M. Harvey , Teresa Partida Manzanera , Guangming Zhang , and Derek R. Braden
Published in: Nondestructive testing and evaluation, 2022, ISSN 1477-2671
Publisher: Informa UK Limited, trading as Taylor & Francis Group
DOI: 10.1080/10589759.2022.2084616