This project achieved its aim of developing a single ceramic chop with multiple functions. The outcome was the production of an integrated RC circuit that has similar stability and performance to the functions provided in non-integrated or single-function chips.
New materials and processes were developed and tested. These included high-temperature co-fired RC circuits and a high-temperature sintering process, which has been patented.
This project opens the possibility for miniaturization of systems, which are now reaching their technological limit due to single chip packaging and the constraints of surface-mounting technology.
Single-function ceramic electronic components have now reached the smallest size compatible with surface mounting technology and remaining the bulky part of electronic system. The next innovative step will be to integrate in the same package complementary materials to produce sophisticated ceramic/metal chips combining several electrical functions. The present project concerns the critical problems related to this step : powder processing, materials, compatibility and interfaces structure.