The white light fringe sensor was able to measure solder joint heights, shape and wetting angle on gull-wing devices. The vision system was able to measure solder joint width and length on gull-wing and J-lead components and was perhaps the most flexible of the sensors. The HDTV sensor could be considered as a direct replacement for any of the cameras used and would provide 4X better resolution or 4X greater field of view over the standard cameras. The X-ray sensor was able to measure a variety of parameters of J-lead, gull wing and ball bump joints, and gave the most detailed information on the joint structure.
No sensor system had the capability to measure wire bond parameters at the time of the evaluation but possibilities in this area did exist for further investigation. The fringe and standard vision sensor were thought to be more applicable to an on-line inspection system and HDTV and X-ray systems to an off-line system used for process development.
The use of 2D vision, 3D high resolution laser and x-ray fine focus techniques will be investigated and a system incorporating a combination of technologies will be developed. The system will be of modular construction to allow appropriate sensors to be used, and include sufficient flexibility to allow for inspection of larger bonds which will continue to be a feature of the mixed interconnection technology boards in the future.
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