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Content archived on 2024-04-16

SURFACE CLEANING OF ELECTRONIC COMPONENTS FOR CLEAN JOINING PROCESSES

Objective

To develop conditions of surface preparation for advanced techniques of soldering and adhering in electronic circuitry.

Field 1 : Investigation by today's analytical means of the nature of surface films on the metallic surfaces of substrates and electronic components , in a produced condition and after special cleaning treatments (etching, etc.).

Field 2 : Development of conditions for soldering without leaving residues, thus avoiding solvent cleaning afterwards (for both wave soldering and reflow soldering).

Field 3 : Development of long-lasting electrical connections using conductive adhesives on cleaned surfaces.

Field 4 : Development of feasible and rapid methods for the assessment of cleanliness of surfaces.

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Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

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Coordinator

Nederlandse Philips Bedrijven BV
EU contribution
No data
Address
Glaslaan 1 218
5600 MD EINDHOVEN
Netherlands

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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

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Participants (5)

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