CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Exploitable results
This project was oriented to the development of two joining technologies for the automotive industry based on high-power laser diodes: soldering/brazing and adhesive pre-activation. The investigation of absorptivity of diode laser radiation showed the advantages of the application of this kind of diode laser with shorter wavelength compared to Nd:YAG - and CO(2) - lasers. The influence of the angle of incidence on the absorptive was less pronounced than expected so that not-polarised 250 W laser prototype was developed.
A new diodebar mounting technology allowing good control of the curvature of the emitting line and a reduced thermal resistance was successfully developed by Thomson-CSF. New generation of 40W laser bars based on a new laser diode structure with a large optical cavity design was produced: improved Catastrophic Optical Damage (COD) threshold on laser facets is associated with a delocalisation of the optical mode which leads to a reduced fast axis divergence of less than 35 degrees FWHM and improved reliability. An estimated lifetime of 20000 hours on 40WCW laser diodes operating at 840nm was demonstrated during the project.
FISBA Optik aimed at the integration of a new micro-optical collimation scheme based on the basic idea of higher power available at higher integration of laser diode bars. The power available with the final prototype (260W) with very tight focusing (Æ<0.8 mm) is an ideal basis for product development and for industrial investigations in different applications. As it was achieved with diode bars operating in the average at 30W, it is easily extrapolated that powers up to 400W are feasible with the rise of power per diodebar towards 40-60W, which are already commercially available.
By process modelling (analytical and finite element) the temperature distribution in the work piece, especially in the plane of joint, was foreseen and the process window of both applications was evaluated.
About soldering and brazing processes screening experiments and process optimisation were carried out for four different joint geometries (strip to strip, strip to wire, flex lead to pin and strip to cord). Good quality and reliability of soldering/brazing processes was demonstrated within the project. For the process qualification were selected four suitable parts: two were already in production, the others were new products and laser soldering was one possibility of the joining technique (in three cases, the feeding of solder alloy was done by solder wire). Partial exploitation of results are already in progress and in particular some laser soldering machines were built up and installed in production at Bosch.
Screening experiments for pre-activation process were carried out considering the influence of process parameters on the temperature rising and the bonding strength. Two different kinds of adhesives, mono component epoxy adhesive and two-part epoxy adhesive, were investigated. The first one allows high strength with long processing times at high activation temperatures, the second can be cured at low temperature and processing time can be minimised but only with low strength.
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