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Development of new dielectric and optical materials and process-technologies for low cost electrical and/or optical packaging and testing of precompetitive demonstrators

Objective



Objectives and content:

The very rapid development and growth in the electronics industry - especially pronounced in areas like infocom (e.g. WWW, inter- and intra-net), information processing and multimedia - demand mass-produced new electronic, opto-electronic and optical products with significantly improved performance at successively lower cost. Various high speed processor-modules and opto/electrical Fiber To The Customer/ Home/ Business/-modules or similar are challenging examples with enormous market potential. The proposed DONDODEM project is an integrated effort to provide novel and improved materials-, process-, device- and production-technologies meeting the very fast growing general demands of low cost high density and high performance electrical and/or optical packaging. Mainly new in organic-organic photo-polymers, ORMOCERs with very good properties and an unique low-temperature curing behaviour should enable the realisation of high density interconnection with large Area processing on low cost polymer substrates (e.g. FR4, BT). Electrical and optical interconnects can be integrated with the same materials in the same process due to simultaneously good dielectric, optical and planarizing properties. A novel proposed concept of integrating replication and photolithography technologies in the same processing equipment has a great potential for e.g. optical & electrical/optical packaging. This concept is viable due to the low viscosity of the inorganic-organic resins and suggested new tools and technologies.

The following exemplifies expected achievements from proposed technology and materials development:
1) material price of 100 - 1000 ECU/kg depending on grade & performance;
2) low processing temperature (120 180 ÐC);
3) permittivity constant E < 2.8;
4) optical loss <0.1 dB/cm at 1300 nm, <0.3dB/cm at 1550 nm;
5)reproducibility of refractive index < +-0.001 for SM-wave guides;
6) very good adhesion to materials used in MCMs, PCBs;
7) advanced precompetitive demonstrators with structures & elements processed lithographically and/or with replication technologies;
8) proven reliability and reproducibility of materials, processes and demonstrators;
9) proven industrial capability including a cost-model for manufacturing various tentative products;
10)commercial availability and demand of materials.

The suggested precompetitive test-objects and demonstrators will guide and balance the specific crucial efforts in the project making DONDODEM to a targeted, well-balanced and unified project with sufficient well-focussed strengths in all parts. Further, the project - with partners carefully selected for skills and complementarity and remarkable industrial interest - is anticipated to show the enormous potential for European industry to capitalise on the proposed materials and technologies. The first products are estimated to reach the market directly after completion of the proposed RTD. BE97-4641

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.*
Address
Neunerplatz 2
97082 Wuerzburg
Germany

Participants (15)

ACREO AB.
Sweden
Address
Electrum 236
Electrum 236 Kista
Bull Sa
France
Address
Rue Jean Jaures
78340 Les Clayes Sous Bois
CHALMERS UNIVERSITY OF TECHNOLOGY
Sweden
Address
6,Elektrogaarden 2
412 96 Goeteborg
Ericsson Components AB
Sweden
Address
16,Isafjordsgatan
164 81 Kista-stockholm
FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.*
Germany
Address
1,Schillerstrasse 1
07745 Jena
Friedrich-Schiller-Universität Jena
Germany
Address
1,Max-wien Platz
07743 Jena
Karl Süss GmbH & Co.
Germany
Address
90,Schleissheimer Strasse
85748 Garching
Micro Resist Technology Gmbh
Germany
Address
Köpernicker Strasse
12555 Berlin
Motorola Ltd
United Kingdom
Address
Colvilles Road
G75 0TG Glasgow
Robert Bosch GmbH
Germany
Address
1,Robert-bosch-platz
70839 Gerlingen - Schillerhöhe
Swiss Center for Electronics and Microtechnology S.A.
Switzerland
Address
569,Badenerstrasse
8048 Zurich
TECHNISCHE UNIVERSITAET BERLIN*
Germany
Address
25,Gustav-meyer-allee 25
13355 Berlin
THALES SYSTEMES AEROPORTES SA
France
Address
Avenue Gay-lussac 2
Elancourt
ViaSystems AB
Sweden
Address
48,Stathögavägen
601 19 Norrköping
W.C. Heraeus GmbH
Germany
Address
12-14,Heraeusstraùe
63450 Hanau