Skip to main content

Technical ceramics machining, using traditional machines to remove chips with the help of laser technology

Objective



The precise machining, or grinding, of hard materials especially ceramics for technical applications is very expensive since, to date, it can only be accomplished usang precision grinding machines. The project consists of using traditional machines and diamond-or special CBN-equipped tools (lathes, milling cutters) to machine these materials by removing chips. That will take place after the material has been rendered workable by modification of its mechanical specifications : the proposed principle is to work the material above its limit of elasticity, this state being provided locally by a laser beam. This technology would signal a revolution in the field of grinding and machining of such materials. Manufacturing costs per piece could be significantly lowered while overall flexibility is increased. Lubrication coolants would no longer be needed. Our company has a department exclusively devoted to grinding this type of material, and we are quite familiar with the avenues of distribution open to these products. Those channels would widen, if the process is proved to be applicable on Alumnnium Oxides as well as on Zirconias and Silicon Nitrides, for both turned and prismatic pieces (lathe and milling cutter produced).

Funding Scheme

EAW - Exploratory awards

Coordinator

Outillage FOC - STOP
Address
7,Avenue Galibert 7
95151 Taverny
France