The industrial objective of the project was to provide European SME supply chain companies with selectively plated, 2 shot moulded electronic interconnector technology, with many advantages over traditional metal insert interconnector products, but with a price reduction of up to 50% depending upon interconnector layout.
During the project, a prototype 2 shot injection mould tool has been manufactured producing components with two IDC features, a spring beam feature and fine line tracks. A prototype manufacturing cell has been designed and manufactured to remove the components from the injection mould tool and place them onto purpose designed plating jigs. A novel selective plating process has been developed to selectively plate the LCP fine tracks and IDC features without bridging. The final solution offers miniaturization, increased functionality and a price reduction of 49% over traditional manufacturing methods.
The final prototype cell has demonstrated that this is a valid route for the production of 2 shot interconnector devices. The developed selective plating process has also demonstrated that components of these dimensions and complexity can be reliably plated. The feasibility of automated component handling and plating jig handling has been proven and repeatable processing windows developed. In addition, case study components have been moulded for use by the Consortium in marketing the technology.