Chip-level optical interconnects using a glass waveguiding "ceiling"

Project Information

Grant agreement ID: FMBI961377

Project closed

Start date 2 January 1997

End date 1 January 2000

Funded under

• Specific research and technological development programme in the field of the training and mobility of researchers, 1994-1998

Total cost No data

EU contribution No data

Coordinated by

Corning Europe Inc.
France

Objective

A novel configuration is proposed for chip-level optical interconnects on processors in order to overcome the communications "bottleneck" associated with reducing chip feature sizes. An opto-electronic overlay Consisting of opto-electronic Chips bonded to a glass waveguiding "ceiling", links the data launch pads. The lasers and receivers with integrated drive circuitry ensure that chip area on the processor is not compromised.
The objective of this project is to fabricate a commercially-viable glass optical "ceiling". Modelling and fabrication trials will investigate the performance of diffractive components defined on glass for coupling of VCSEL lasers to multimode guides and from guides to pin detectors aiming to achieve 25% coupling efficiency for data rates of up to lGb/s. A complete optical ceiling will be designed and fabricated including diffractive couplers, waveguide interconnects, power splitters and interfaces to external fibres, aiming for an interconnection density of 100/cm2.

Fields of science

• engineering and technology › materials engineering
• natural sciences › physical sciences › optics › laser physics

Programme(s)

• FP4-TMR - Specific research and technological development programme in the field of the training and mobility of researchers, 1994-1998

Topic(s)

• 0302 - Post-doctoral research training grants
• TI04 - Electrical Engineering

Call for proposal

Data not available

Funding Scheme

RGI - Research grants (individual fellowships)

Coordinator

Corning Europe Inc.

• EU contribution: No data
• Address: 7 BIS,Avenue de Valvins ; 77210 Avon ; France
• Total cost: No data

Participants (1)

Not available

United Kingdom

• EU contribution: No data
• Total cost: No data