- Industrial production procedures for the manufacture of marketable products are to be developed from the basic technology. Special substrates and MCMs will be produced to evaluate the parameters of this technology.
- Cell libraries for both active and passive components to be used in the design of substrates will be made available.
- Various built in test structures are to be designed and integrated on to silicon substrates. In this way the testability of MCMs can be improved by the use of active substrates.
- A set of analogue and digital simulation cells is to be designed and made available for simulation of the substrate system before production.
- Operative MCMs demonstrating the tools and technologies developed are to be produced. These will undergo a full characterisation to ensure that they comply with the requirements of specific applications in terms of reliability and quality.
A cost-efficient, commercial manufacturing base is to be established in silicon-based multi-chip modules (MCMs) with active substrates and ball grid array interconnects. The new feature of this technology is the integration of passive and active components in the substrate which would otherwise be connected to an MCM via wirebonding. The first level connection of the standard ICs to the substrate is done using a flip chip interconnect. Development of a commercial source for wafer rerouting to facilitate flip chip interconnects also constitutes a major project goal.
Funding SchemeEST - Marie Curie actions-Early-stage Training