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Content archived on 2024-05-14

Ball grid array inspection equipment assessment

Objective

To evaluate the capability of the LI-8250 system to perform a 100% cost effective 3d inspection of BGA components.

To prove the capability, accuracy and cost effectiveness of the system to perform as well 3D inspection of leaded components.

To evaluate the change-over speed from one package type to another.

To benchmark the equipment against competing inspection systems.

Ball grid arrays (BGAs) are a relatively new type of components, which offer numerous advantages over leaded components and are expected to grow strongly in the coming years. Annual growth rates of 50% are forecast.
At present there are very few systems on the market for three-dimensional inspection of BGAs. They are all laser based and are adaptations of existing systems for inspection of leaded components.
ICOS from Heverlee in Belgium, has developed an inspection technique which is dedicated to BGA packages and offers several major advantages over laser systems.
The assessment of the LI-8250 3D BGA inspection system is to be carried out in the production environment of Mietec. The equipment will be benchmarked primarily against competing American equipment. Parameters to be assessed include accuracy, repeatability, throughput, mean-time-between-failure, uptake and change-over speed. A cost of ownership model will be defined.

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EIF - Marie Curie actions-Intra-European Fellowships

Coordinator

Alcatel Microelectronics N.V.
EU contribution
No data
Address
Westerring 15
9700 Oudenaarde
Belgium

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Total cost

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