Sensor encapsulation by silicon bonding (SESIBON)

Objective

Aim: low-cost reliable products and processes using advanced wafer bonding. Application area: microsystems, a rapidly evolving market where production yield, cost and high-volume production capability are key issues.

Major advancements:
- Development of low-temperature processes for bonding of pre-processed wafers resulting in commercial products and added-value substrates for microsystems. The technology developed in the project will enable custom-designed advanced silicon substrates containing hermetically sealed cavities, thin membranes and multiple etch-stop layers;
- Advanced low-cost wafer-level packaging of microsystems using anodic bonding of silicon to glass with emphasis on reliability of electrical feed-throughs and sealing of cavities. This is obtained by innovative low-temperature techniques and major improvements of methods for anodic bonding.
The main achievements of the project include the following:
1) The project designed and developed the first context-based system for young people. This involved the development of a Mobile Service Platform (MSP) and a set of applications and services hosted by the MSP.
2) A number of new ideas and technologies have been integrated into both the MSP and the applications. For example: First WAP-Push Applications in Norway, first system to combine location-based information with other applications and services, services were integrated with three live telecommunication services – WAP, GPRS, GSM-based positioning.
3) The MSP and the associated applications were subjected to a demanding user trial in which 64 teenagers in Grimstad (Southern Norway) used the system for a period of 4 months.
4) One important outcome of the user trials was the fact that the system was taken up and used by a significant proportion of youngsters. This is very encouraging in view of the limited group size and the fact that it cut across existing social groupings.
5) Equally important is the fact that the Youngster services including the location-based service (“Find a Friend”) became a routine part of everyday life for a group of advanced users, despite initial scepticism.
6) The user trial produced useful insights into the drivers and barriers to adoption by youngsters.
7) A study of different business models resulted in a set of recommendations for ways of financing these new services.

Fields of science

• social sciences › economics and business › business and management › business models
• engineering and technology › materials engineering
• engineering and technology › electrical engineering, electronic engineering, information engineering › electronic engineering › sensors
• natural sciences › chemical sciences › inorganic chemistry › metalloids

Programme(s)

• FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Topic(s)

• 1.1.3.-1. - Key Action Innovative Products, Processes and Organisation

Call for proposal

Data not available

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

SENSONOR ASA

Address

Knudsroedveien 7
3192 Horten
Norway

Links

Participants (6)

CHALMERS UNIVERSITY OF TECHNOLOGY

Sweden

Address

6,elektrogaarden 2
412 96 Goeteborg

Links

DANFOSS A/S

Denmark

Address

81,nordborgvej 81 E14-s11
6430 Nordborg

Links

OKMETIC OY

Finland

Address

2,pütie 2
01510 Vantaa

Links

SAAB MICROTECH AB

Sweden

Address

Sven Hultinsgata 9b
412 88 Goeteborg

Links

TECHNICAL UNIVERSITY OF DENMARK

Denmark

Address

Technical University Of Denmark, Oerstedt Plads, B
2800 Lyngby

Links

UNIVERSITE DE NEUCHATEL

Switzerland

Address

1,rue Jaquet-droz 1
2007 Neuchatel

Links