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Sensor encapsulation by silicon bonding (SESIBON)

Objective

Aim: low-cost reliable products and processes using advanced wafer bonding. Application area: microsystems, a rapidly evolving market where production yield, cost and high-volume production capability are key issues.

Major advancements:
- Development of low-temperature processes for bonding of pre-processed wafers resulting in commercial products and added-value substrates for microsystems. The technology developed in the project will enable custom-designed advanced silicon substrates containing hermetically sealed cavities, thin membranes and multiple etch-stop layers;
- Advanced low-cost wafer-level packaging of microsystems using anodic bonding of silicon to glass with emphasis on reliability of electrical feed-throughs and sealing of cavities. This is obtained by innovative low-temperature techniques and major improvements of methods for anodic bonding.
The main achievements of the project include the following:
1) The project designed and developed the first context-based system for young people. This involved the development of a Mobile Service Platform (MSP) and a set of applications and services hosted by the MSP.
2) A number of new ideas and technologies have been integrated into both the MSP and the applications. For example: First WAP-Push Applications in Norway, first system to combine location-based information with other applications and services, services were integrated with three live telecommunication services – WAP, GPRS, GSM-based positioning.
3) The MSP and the associated applications were subjected to a demanding user trial in which 64 teenagers in Grimstad (Southern Norway) used the system for a period of 4 months.
4) One important outcome of the user trials was the fact that the system was taken up and used by a significant proportion of youngsters. This is very encouraging in view of the limited group size and the fact that it cut across existing social groupings.
5) Equally important is the fact that the Youngster services including the location-based service (“Find a Friend”) became a routine part of everyday life for a group of advanced users, despite initial scepticism.
6) The user trial produced useful insights into the drivers and barriers to adoption by youngsters.
7) A study of different business models resulted in a set of recommendations for ways of financing these new services.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

SENSONOR ASA
Address
Knudsroedveien 7
3192 Horten
Norway

Participants (6)

CHALMERS UNIVERSITY OF TECHNOLOGY
Sweden
Address
6,Elektrogaarden 2
412 96 Goeteborg
DANFOSS A/S
Denmark
Address
81,Nordborgvej 81 E14-s11
6430 Nordborg
OKMETIC OY
Finland
Address
2,Pütie 2
01510 Vantaa
SAAB MICROTECH AB
Sweden
Address
Sven Hultinsgata 9B
412 88 Goeteborg
TECHNICAL UNIVERSITY OF DENMARK
Denmark
Address
Technical University Of Denmark, Oerstedt Plads, B
2800 Lyngby
UNIVERSITE DE NEUCHATEL
Switzerland
Address
1,Rue Jaquet-droz 1
2007 Neuchatel