Objective
While testing electrical properties in microsystems is a well-developed art the testing of mechanical properties of MicroElectroMechanical Systems (MEMS) is not. However, the micromechanical characterisation plays a crucial role, both during design and development of microstructures and during chip-production, assemblage and life cycles of the finished MEMS products.
Two different optical approaches are proposed to improve the MEMS testability, based on:
i) on-chip integrated techniques and;
ii) external full-field interferomety. The qualification and validation of proposed testability procedure is made by industrial driven demonstrations and application examples (data storage, microsensors for avionics). The OCMM proposal represents the European module of a world-wide cluster that is going to co-operate within an IMS action, where an interdisciplinary and industry-led consortium has been formed.
Keywords
Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
25030 BESANCON
France