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Content archived on 2024-05-27

Development of innovative manufacturing techniques for the production of super large silicon wafers for the next millennium

Objective

US and Japanese companies currently lead the field in semiconductor manufacture. It is of strategic importance to provide European companies with new technologies which they can then deploy to head off non-European competition. The aim of this project is to develop a cost reducing, reliable and quality oriented process chain for 200 and 300 mm water manufacturing It provides an substantial contribution to the modernisation of European semiconductor equipment industry. The development of up to now unknown machines and processes like the multi-wire slicing with new wire guidance features, the unprecedented high throughput double- side grinding of the sliced wafers and the development of a new wafer geometry metrology device leads to a sustained improvement of European competitiveness against its us and Japanese competitors.

Fields of science (EuroSciVoc)

CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.

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Programme(s)

Multi-annual funding programmes that define the EU’s priorities for research and innovation.

Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

Data not available

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

CSC - Cost-sharing contracts

Coordinator

THEMIS A.S.
EU contribution
No data
Address
Horni Paseky 1389
756 61 ROZNOV POD RADHOSTEM
Czechia

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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

No data

Participants (7)

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