Objective
The aim of this project is to develop new materials and processing techniques for bonding and underfilling of flip chips and bonding of heatsinks in order to realise a step improvement in flip chip technology and to allow a further minituarisation (in the design) of microelectronic products. The goals are: a reduction of 40% in size, weight, material consumption and power consumption of various products like mobile telecommunication equipment, computers, monitors, controller units for automotive applications, etc.
Targeted developments are:
1) new underfill materials containing nano size fillers with superior properties;
2) new electrically and/or thermally conductive adhesives;
3) a transfer moulding process capable of underfilling flip chips in mass volumes (e.g. 200 in one pass) at low costs;
4) an inkjet dispensing technique for electrically and thermally conductive adhesives.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
1780 AM DEN HELDER
Netherlands
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.