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Innovative thermo-mechanical prediction and optimisation methods for virtual prototyping of miniaturised electronic packages and assemblies

Objective

Integrated circuits play a vital role in ICT. The ongoing trend of miniaturisation and function integration is pushing technology from micro to nano scales. As a consequence, thermo-mechanical failures, accounting for 65% of the total failures and originating from the product/process design phase, will become even more critical Thus, innovative thermo-mechanical design of micro electronic packaging and assemblies, fivirtual thermo mechanical prototyping, is required to reduce cost and time-to-market and to design in reliability. The results will substantially enhance the efficiency, accuracy and capability of virtual thermo mechanical prototyping method. Exploitation will lead to improvement of thermo- mechanical reliability (1% higher yield) and reduced time-to market by at least 30%. This project consists of 4 scientific innovations verified by experiments including software, and virtual thermo mechanical prototyping as the technical innovation.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

PHILIPS ELECTRONICS NEDERLAND B.V.
Address
Graslaan 2, Building Saq
5600 MD Eindhoven
Netherlands

Participants (8)

AMIC ANGEWANDTE MICRO-MESSTECHNIK GMBH
Germany
Address
Volmerstrasse 9B
Berlin
DELFT UNIVERSITY OF TECHNOLOGY
Netherlands
Address

2600 GA Delft
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany
Address
Leonrodstrasse 54
80636 Muenchen
KITRON DEVELOPMENT AB
Sweden
Address
Bataljonsgatan 10
SE 551 10 Joenkoeping
LEUVEN MEASUREMENTS AND SYSTEMS INTERNATIONAL NV
Belgium
Address
Interleuvenlaan 68, Researchpark Haasrode
3001 Heverlee
NETHERLANDS ORGANISATION FOR APPLIED SCIENTIFIC RESEARCH - TNO
Netherlands
Address
De Rondom 1
5612 AP Eindhoven
THALES MICROELECTRONICS SA
France
Address
Bellevue Z.i.
35221 Chateaubourg
WROCLAW UNIVERSITY OF TECHNOLOGY
Poland
Address
Janiszewskiego 11/17
50 372 Wroclaw