CORDIS - EU research results
CORDIS

3-d radiation imaging detectors

Objective

Pixellated semiconductor detectors will be fabricated in the form of so-called "3-D" detectors. Instead of conventional, planar electrodes on the wafer surfaces, a matrix of uniform holes will be created through the semiconductor wafer thickness, and electrical contacts and/or p-n junctions created on the walls of these holes. Simulation studies and early prototyping show that detectors of this topology require lower bias voltages and are more radiation resistant. The project will develop methods for achieving smooth walls in the holes and for filling them with scintillator, to achieve higher conversion efficiency for X-ray detection. A further development will assess the value of this processing technology for neutron imaging applications by developing techniques for filling the pores with a suitable neutron converter material, such as LiF.

Call for proposal

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Coordinator

UNIVERSITY OF GLASGOW
EU contribution
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Address
UNIVERSITY AVENUE
G12 8QQ GLASGOW
United Kingdom

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Participants (7)