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Environmentally friendly process for new low cost copper carbon materials for future thermal management applications

Objective

TherMat addresses the major challenge facing the electronics industry today of improving reliability by cost-effective control of thermo-mechanical stress within devices and assemblies. The use of currently available materials results in significant assembly and functional limitations to achieve reliable products. New controlled thermal expansion materials for use as thermal heat-sinks are urgently needed by industry.

The purpose of this project is to ease this thermal problem by developing a clean, low cost and easy to use process for metallic coating of micronic and sub-micronic particles. Societal impacts resulting from this development will beimproved European competitiveness. In addition, a general societal impact via the dissemination of technical skills will reinforce the skills and knowledge base of Europe's materials science.

Call for proposal

2000/C 359/07
See other projects for this call

Coordinator

CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
Address
Rue Michel-ange 3
Paris
France

Participants (7)

DANFOSS SILICON POWER GMBH
Germany
Address
Heinrich-hertz-strasse 2
Schleswig
FUNDACION INASMET
Spain
Address
Mikeletegi Pasealekua 2, Parque Tecnologico
San Sebastian
NOT AVAILABLE
Norway
OPEN MIND
France
Address
Centre Condorcet, Avenue Du Docteur Albert Schweitzer, 167
Pessac
RADSTONE TECHNOLOGY PLC
United Kingdom
Address
Water Lane
Towcester
SEMELAB PLC
United Kingdom
Address
Coventry Road
Lutterworth
THALES S.A.
France
Address
Boulevard Haussman 173
Paris