Numerical simulation of packaging processes for electronic devices

Objective

Computer modelling of material characteristics in packaging and encapsulation processes, experimental validation, implementation to FEM-based software codes, adaptation to specific processes.

Programme(s)

• FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Topic(s)

• 1.1.3.-5. - RTD Activities of a Generic Nature : materials and their technologies for production and transformation and new and improved materials and production technologies in the steel field

Funding Scheme

BUR - Bursaries, grants, fellowships

Coordinator

ROBERT BOSCH GMBH.

Address

Robert-bosch Platz 1
70049 Stuttgart
Germany