Objective
This project aims to produce a new inspection technique for soldered joints on Printed Circuit Board assemblies using X-ray inspection and 3-D image analysis. The continuity of soldered connections on printed circuit board (PCB) assemblies is of paramount importance in ensuring the reliability of almost any electronic device. The need exists for a fast, reliable QA testing methodology, which will increase reliability and reduce manufacture time of PCBs . The opportunity exists to use 3-D X-ray visualization technology, presently being developed in the medical field, to produce a non-contact, once-through x-ray scanning system capable of detecting flaws in multi-layer PCB assemblies by comparing the manufactured device with an image of a "perfect model" .
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensors
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Call for proposal
Data not availableFunding Scheme
EAW - Exploratory awardsCoordinator
NG2 4LA MANSFIELD
United Kingdom