Objective
This project made the NMRC reliability, failure analysis and reverse engineering facility, established to support the ESA and to meet ESA standards, available for external users. The facility is unique in that reliability is addressed at all levels from chip to circuit board and is fully supported by the IC design and fabrication facilities of the NMRC. The facility allows users to evaluate, in one location, the reliability of new microelectronic technologies or electronic assemblies to the most exacting national and international standards.
The LIP grant allowed the centre to upgrade its facilities in both the reliability and failure analysis areas. The capability to complete reliability evaluations and failure analysis on IC devices as well as package and system level assemblies meant that many research disciplines within microelectronics can now be catered for through this facility.
Typical project examples included:
- Electromigration failure verification in multilayer IC metallisation
- Antireflectance coating characterisation for IC surface applications
- Chip-on-Board failure analysis
- IR imaging of electromigration test die to determine metallisation temperature
- Thermal and acoustic imaging for die attach optimisation
- Solder joint reliability evaluation to investigate effects of substrate and reflow method
- Refractory metallisation reliability characterisation for high temperature IC applications.
In addition to the above projects, a strong training programme has been developed with many institutes visiting to take courses in IC failure analysis techniques.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology materials engineering coating and films
- natural sciences physical sciences electromagnetism and electronics microelectronics
You need to log in or register to use this function
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Data not available
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Data not available
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
30 CORK
Ireland
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.