Objective
Size-Strain III is the third of a successful conference series initiated 6 years ago (Liptovski Mikulas (SK), 1995; Freiberg (D), 1998), concerning the study of engineering materials by diffraction techniques. Within this very broad theme, the Size-Strain III subtitle (Analysis of Microstructure and Residual Stress by Diffraction Methods), suggests the specific topics of interest.
Call for proposal
Data not availableFunding Scheme
SC - High Level Scientific ConferenceCoordinator
38050 BIENO
Italy