Objective
Foreseen Results
The project will enable the participating CCE to solve the specific problems concerning their electronics assembling industry, and to achieve sustainable economic development in the field. From the running of the established CHEAP-MUTI-CHIP facilities the European industry will also get much benefit.
The success of the electronics industry of a region of smaller co-operating countries or a larger country mainly depends on the ability to use the most cost-effective and possibly advanced interconnection and packaging technology. The reason for this is that the performance of today's electronic equipment is primarily limited by the interconnections between components and subsystems and not by the high-speed, very large scale integrated (VLSI) circuits from which the systems are constructed. Thus, to achieve high performance at a reasonably low cost, it is imperative to safeguard and exploit the existing design, manufacturing, assembly, testing technology and intellectual potential in the field of electronics interconnection and packaging.
Recognising the immediate need for improvement of the technological capabilities of low cost, high performance electronic circuit modules in Countries of Central Europe (CCE), Research Institutes (RIs) and Small/Medium-sized Enterprises (SMEs) of Hungary, Romania and Slovenia with the support of relevant and high reputation institutions of the United Kingdom and Belgium apply for the assistance of the European Union (EU) in the frame of Research and Technology Development (RTD) Joint Project by means of shared-cost action. Multichip module (MCM) technology, utilising and/or uniting the advantages of ceramic (C), depositing (D) and laminating (L) techniques, is a promising solution of the requirements.
The aim of the RTD Project is to strengthen the relationship between research institutions of CCE and their EU Partners in order to enhance research and technological capacities in CCE, and establish links with the newly formed SMEs responsible for product development and distribution.
The technology of electronic circuit modules includes the design, manufacturing, assembling and testing phases. The tasks of the project will be divided among the participants in accordance with these technological phases and conformable to the interest and previous activity of the participants. The Rumanian Partners will select a suitable CAD system, will install it for themselves and for the other Partners, and will organise seminars. Manufacturing is the task of the Hungarian and the Slovenian Partners. They will improve their MCM-L and MCM-C facilities and technology up to a level to fulfil the low cost, fast prototyping requirements of the participating CCE. With the promotion of the UK and the Belgian Partners, exploiting their high level experience in the fields of microjoining and test technology, respectively, the Hungarian Partner will establish mounting and bonding facility for the assembling of MCMs. The final test of the modules and the evaluation of the results in accordance with the reliability, applicability and profitability aspects will be the task of the Belgian Partner. The Project will be carried out in close co-operation of all Partners, and they will organise Project Meetings and Seminars themselves, and training courses for SMEs and RIs of CCE and EU countries who show interest in the progression and the application of the establishment of low cost fast prototyping CHEAP-MULTI-CHIP technology.
Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
1111 BUDAPEST
Hungary