Objective Industrial need is given for high performing materials in electronic packaging systems as well as in other electronic and electrical systems for devices working under high current densities and high thermal load. The project's aim is to develop new Carbon fibre reinforced Copper matrix composites whereby the thermal expansion is controlled and the thermal conductivity is enhanced. Besides a high stiffness and very good electrical conductivity is also expected. The unique combination of the low and adaptable coefficient of thermal expansion with extraordinary high thermal conductivity will make the material useful for heat sinks applications, in particular for electronics (Hybride Modules, Electronic Relays) and for electrically conducting springs. The envisaged material and its use are expected to give the European Industry in this field a lead for e.g. miniturizing electronics. For that purpose 3 possible production routes (Powder Metallurgy, Diffusion Bonding of Cucoated fibres, Infiltration of C-fibre preforms with Copper melt) will be developed and be brought from laboratory to demonstrator scale. Suitable test pieces will be characterizèd with respect of their properties and investigated in demonstrator tests at the end-users. Final evaluations about efficiency and economics are expected for outlining and initiating a "new product" line. In the projects are involved 6 partners from 4 different EU-members, 2 partners from CCE-countries will participate additionally with essential contributions. Fields of science natural sciencesphysical scienceselectromagnetism and electronicsengineering and technologymaterials engineeringcompositessocial scienceseconomics and businesseconomicsengineering and technologymaterials engineeringmetallurgy Programme(s) FP4-INCO - Specific research, technological development and demonstration programme in the field of cooperation with third countries and international organizations, 1994-1998 Topic(s) 0201 - Mathematics and information sciences Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator AUSTRIAN RESEARCH CENTERS SIEBERDORF EU contribution No data Address 2444 SEIBERSDORF Austria See on map Total cost No data Participants (2) Sort alphabetically Sort by EU Contribution Expand all Collapse all Institute of Electronic Materials Technology Poland EU contribution No data Address 133,ul. Wolczynska 01 919 Warszawa See on map Total cost No data Institute of Materials and Machine Mechanics - Slovak Academy of Sciences Slovakia EU contribution No data Address 75,Racianska 830 08 Bratislava See on map Total cost No data