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Content archived on 2024-05-27

300 mm Silicon Service Centre

Objective

The European semiconductor equipment industry - mostly SMEs - is facing the transition to 300 mm processing, which has been delayed worldwide and is only now really starting. The objective of the project is to offer a structure to the equipment suppliers that provides low cost 300 mm silicon wafer services for Proof of Concept Tests under SEA mainly at supplier sites (similar to wafer, analytical and metrology support offered in SEA 300 under Esprit). As there is no single site existing to provide such support, 300SiSC will co-ordinate such services from wherever they can be received at the required quality and at competitive costs. Taking advantage of their experience in 300 mm processing, 300SiSC will co-ordinate its work with dissemination activities for assessment take-up measures under IST in FP5 (project IST-11025, SEAD).

Fields of science (EuroSciVoc)

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Programme(s)

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Topic(s)

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

ACM - Preparatory, accompanying and support measures

Coordinator

CENTRE COMMUN DE MICROELECTRONIQUE DE CROLLES
EU contribution
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Address
ZI DU PRE ROUX
38190 CROLLES
France

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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

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