Objective
The purpose of the project is to trial different microelectronics and packaging technologies in the perspective of the 3rd generation multi-mode wireless terminals with a contribution to the integration/performance/cost issue. These technologies: monolithic process (BiCMOS), advanced organic substrate (HDI), advanced ceramic and ferrite materials and process (LTCC, multilayers on ferrite) are candidates for integration of radio blocks for wide band terminals. Two radio modules identified as blocking path (wideband VCO and tuneable filters) will be used to make these trials focusing on a tri-mode application with UMTS/TETRA/TETRAPOL modes implementation. Materials, process, components will be tested to best estimate their respective cost and performances and to let know to the mobile community the design guidelines necessary to complement these functions in a smart way.
Objectives:
The purpose of the project is to trial different microelectronics and packaging technologies in the perspective of the 3rd generation multi-mode wireless terminals with a contribution to the integration/performance/cost issue. These technologies: monolithic process (BiCMOS), advanced organic substrate (HDI), advanced ceramic and ferrite materials and process (LTCC, multilayers on ferrite) are candidates for integration of radio blocks for wide band terminals. Two radio modules identified as blocking path (wideband VCO and tuneable filters) will be used to make these trials focusing on a tri-mode application with UMTS/TETRA/TETRAPOL modes implementation. Materials, process, components will be tested to best estimate their respective cost and performances and to let know to the mobile community the design guidelines necessary to complement these functions in a smart way.
Work description:
The project should be considered as a multi TRIALs project to compare results coming out from different processes and to define Application Oriented Design Guidelines which will indicate when to use the right process from economical and technical points of view. For the 2 stumbling stones of future multi-mode 3G terminals (wideband VCO and tuneable filters), 4 technologies will be tested after a common phase of specifications with the following five trials:
- trial of LTCC process for tunable filters implementation- trial of HDI organic substrate for VCO module
- trial of multilayer ferrite substrate for tuneable IF filters implementation
- trial of BiCMOS monolithic process for VCO implementation
- trial of BiCMOS monolithic process for RF tuneable filter UMTS, TETRAPOL and TETRA will be the references specifications for the trials. After the modules characterization phase, a design guidelines will be produced and disseminate inside the wireless community in Europe through Forums and publications.
Milestones:
MS1: Set of specifications for VCO and filter functions for radio application
MS2: Simulation results for both functions (filtering and VCO) against specifications
MS3: Hybrid filters deliveries
MS4: HDI Substrate characterization
MS5: Measurement result
MS6: Application oriented design guidelines to be disseminated.
Funding Scheme
ACM - Preparatory, accompanying and support measuresCoordinator
78180 Montigny Le Bretonneux
France
Participants (4)
08292 Esparreguera (Barcelona)
95180 Berg / Oberfranken
35510 Cesson Sevigne
1930 Zaventem
