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Content archived on 2024-05-18

High density Interconnection for Space, Avionics and enterprise Mobility Applications


The aim of this proposal is to provide to a new set of users (satellite systems, avionics systems and business mobility wireless services) the access to the High density Interconnection Printed Circuit Board technology. The consortium Users are mainly involved in low or medium volumes for high performances and high reliability applications. Associated with a well-experienced HDI PCB supplier, in order to guarantee a successful access, they wish to try this high volume technology in their applications. The objective of this proposal is to try this HDI technology as such or with a fine tuning, in the context of more severe environmental and functional requirements within a program described below.
- Transfer of the HDI design methodology from the supplier to the Users partners.
- Design of the tests vehicles PCBs manufacturing and components assembly.

The derived objectives are first to implement the HDI technology in a PCB test vehicle derived from reference boards. Then, validate that the HDI technology is compatible regarding the actual environmental requirement for space, avionics and professional wireless applications: at material level, process level and reliability level. Demonstrate that the use of the HDI technology lead to improve the electrical performances of the applications (especially EMI and CEM performances using embedded metallic shielding) and demonstrate that the use of this technology lead to enhance the system integration and reduce the weight size and layers count.

Work description:
For the users, this program aims at the introduction of HDI PCB technology for the design of new products. For this purpose, the technical approach for this trial program will be as follow.
The first step is dedicated to the selection of the HDI technology and the definition of the design rules to be used (transfer of AT&S design know-how), the assessment of the Users requirements and constraints, the definition of the test vehicles, and the definition of the tests that will be performed to check the compatibility of the HDI technology with Users constraints. MNC will investigate the global impact of this technology on a functional application (electrical tests & component assembly process) whereas MMS and AMA will focus their trials at the PCB level.
The second step will be dedicated to the design of the technological test vehicle that will be jointly undertaken by MMS and AMA. The design of the functional test vehicle that be undertaken by MNC Manufacturing files will be issued and reviewed with AT&S before manufacturing.
At the third step the test vehicles will be manufactured by AT&S. The users will assist AT&S in case of any problems related to the design of the test vehicles. Concerning functional test vehicles MNC will perform the components assembly. The characterisation and test plan will then be undertaken during the fourth step. MMS will perform the evaluation tests except thermal cycling, humidity test, thermal shock and life test that will be performed by AMA. MNC will perform the functional electrical tests. At the last stage conclusions will be drawn concerning the compatibility of HDI technology with Users environment. The economical benefits will be evaluated and an implementation plan of HDI on future products will be issued.

PCB HDI technology design rule document which define the technology parameters selected for users applications, the test vehicles definition and test plan document month 3.
Manufacturing files for the test vehicles at month 7 (run 1) and month 13 (run 2).
Manufacturing test vehicles at month 9 (run 1) and month 17 (run 2).
Technological test vehicle report month 13.
Functional vehicle test reports month 17.
Conclusion report and implementation plan month 18.

Call for proposal

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Participants (3)