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A “Smart” Self-monitoring composite tool for aerospace composite manufacturing using Silicon photonic multi-sEnsors Embedded using through-thickness Reinforcement techniques

Project description

Silicon photonic sensors for aerospace composites manufacturing

An increase in airline traffic, coupled with rising fuel costs and strict environmental regulations, is driving the increased use of composite materials in the aerospace industry. Using silicon photonic multi-sensors, the EU-funded SEER project is developing smart self-monitoring composite tools to measure process and material parameters. The aim is to leverage machine learning to provide unprecedented reliability of the cured part while significantly cutting costs through preventive maintenance of the tools. Specifically, the project will develop miniature photonic sensors to embed in the tool with through-the-thickness techniques that minimise alteration of the tool's structural integrity. The sensors will be capable of providing temperature, refractive index and pressure data of the composite part without compromising its structure. It will also provide a part quality fingerprint, ensuring the quality of the part based on the undergone curing process. The SEER solution will be made compatible with existing composite manufacturing and measurement methods.

Call for proposal

H2020-ICT-2019-2
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Coordinator

INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS
Address
Patission Str. 42
10682 Athina
Greece
Activity type
Research Organisations
EU contribution
€ 715 860

Participants (10)

LOIRETECH INGENIERIE
France
EU contribution
€ 572 733,50
Address
9 Rue Du Moulin Casse Pole Industriel Jules Verne
44340 Bouguenais
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
AIRTIFICIAL AEROSPACE & DEFENSE SAU
Spain
EU contribution
€ 208 250
Address
Calle Ingenieria 4, Tecnoparque Bahia De Cadiz Carretera De Sanlucar De Barrameda, Km 5,5
11500 Puerto De Santa Maria Cadiz
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
TWI LIMITED
United Kingdom
EU contribution
€ 706 225
Address
Granta Park Great Abington
CB21 6AL Cambridge
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium
EU contribution
€ 498 062,50
Address
Kapeldreef 75
3001 Leuven
Activity type
Research Organisations
ENGINEERING TECHNOLOGY SOLUTIONS EE
Greece
EU contribution
€ 343 000
Address
Domokoy 15
153 44 Gerakas
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
CRANFIELD UNIVERSITY
United Kingdom
EU contribution
€ 399 948,75
Address
College Road
MK43 0AL Cranfield - Bedfordshire
Activity type
Higher or Secondary Education Establishments
ARGOTECH AS
Czechia
EU contribution
€ 506 275
Address
Holubova 978
547 01 Nachod
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
AERNNOVA ENGINEERING DIVISION SAU
Spain
EU contribution
€ 406 805
Address
Calle Leonardo Da Vinci Minano Sn
01510 Vitoria Gasteiz
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
BRUNEL UNIVERSITY LONDON
United Kingdom
EU contribution
€ 591 875
Address
Kingston Lane
UB8 3PH Uxbridge
Activity type
Higher or Secondary Education Establishments
ELLINIKI ENOSI FOTONIKIS ASTIKI MIKERDOSKOPIKI ETAIRIA
Greece
EU contribution
€ 140 250
Address
Kolokotroni 8
10561 Athina
Activity type
Other