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Silicon carbide photonic integrated circuit training network

Project description

Advancing photonic integrated circuits using silicon carbide

Microelectronic integrated circuits (ICs) are key for most electronic devices and technologies, allowing for increasingly complex and computationally strong solutions and technologies. Unfortunately, their high energy consumption and speed limitations are becoming serious obstacles to their advancement. Photonic integrated circuit (PIC) technology could allow them to overcome this challenge. With the support of the Marie Skłodowska-Curie Actions programme, the SiCPIC project aims to use silicon carbide (SiC) to unlock key new optical properties. The project will draw inspiration from nanotechnology innovations to integrate SiC into PIC technology. It will also train doctoral candidates in PIC technology to introduce novel ideas and expertise into their projects and the wider sector.

Objective

Photonic integrated circuit (PIC) technology is an enabling technology, deemed to address the challenges (high power consumption and large RC delay caused by the line width reduction) faced by microelectronic integrated circuits (IC). The demand for the technology is at an all-time high, and it is expected to experience a steadily accelerating adoption across markets. However, the potential of PIC is not fully demonstrated in the existing material platforms yet. Silicon carbide (SiC), an emerging wide band-gap semiconductor, is promising to advance PIC technology and accelerate its wide market adoption. The SiCPIC DN will: i) Break new ground in PIC technology by unlocking the unique optical properties of SiC leveraging the advancing of nanotechnology including thin film transfer and nanofabrication; and ii) Train 15 Doctoral Candidates (DCs) with out-of-the-box thinking and an entrepreneurial mindset in the field of PIC technologies as a specific expertise, and photonic and electronic integration (i.e. semiconductor) skills, and expertise in a broader perspective (i.e covering a full chain of materials, devices and integration, and system applications). SiCPIC, therefore, creates a platform solution ensuring European leadership in next-generation PIC technologies and delivers skills which are key for the implementation of the EU Chips Act, and for wider European semiconductor autonomy.

Fields of science (EuroSciVoc)

Keywords

Programme(s)

Topic(s)

Funding Scheme

HORIZON-TMA-MSCA-DN - HORIZON TMA MSCA Doctoral Networks

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Call for proposal

(opens in new window) HORIZON-MSCA-2024-DN-01

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Coordinator

DANMARKS TEKNISKE UNIVERSITET
Net EU contribution
€ 1 679 450,40
Address
ANKER ENGELUNDS VEJ 101
2800 Kongens Lyngby
Denmark
Region
Danmark Hovedstaden Københavns omegn
Activity type
Higher or Secondary Education Establishments
Links
Total cost
No data

Participants (4)

Partners (8)