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CORDIS

European Consortium for Accelerating Innovations in Electronic Packaging Manufacturing

Project description

Strengthening Europe’s electronics packaging

Today’s electronics are smaller and faster because of improved assembly and packaging technologies. This is crucial for incorporating more functions into compact devices. With this in mind, the EU-funded E2PackMan project aims to improve the production ecosystem in Europe. It brings together partners from 13 countries and links major semiconductor manufacturers with small and medium-sized enterprises to develop improved materials, processes, and equipment for packaging. The project covers the entire value chain, from materials research to test-build validation. The project’s main goal is to increase industrial capacity, support innovation, and maintain Europe’s leading position in modern microelectronics.

Objective

"The Chips JU project E2PackMan contributes to strengthen innovation and packaging production in Europe to improve the ecosystem for leading edge / advanced electronics. Integration of more functionality in smaller volume is still the major driver in microelectronics. In order to facilitate further miniaturization, assembly and packaging (A&P) is becoming of increasing importance for the value chain of a microelectronic product.
To secure the future of electronic products ""Made in Europe"", we need a big push to strengthen innovation and production in the A&P sector. Thus E2PackMan will push materials research as well as innovative equipment and process developments. The focus of this research will be on catalyzing industrial production capabilities in Europe, both strengthening the production capabilities of the large semiconductor suppliers in Europe and creating a network that enables SMEs to produce their innovative devices in Europe.
A world-class consortium of 60 partners from 13 European countries has been brought together to push advanced packaging in Europe towards heterogeneous system integration: The E2PackMan -EU project tackles a coherent approach that includes the whole value chain from material, process and technology developments validated by test-builds including the interface of the package to the chips and to the board/system.
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Fields of science (EuroSciVoc)

Keywords

Programme(s)

Topic(s)

Funding Scheme

HORIZON-JU-IA - HORIZON JU Innovation Actions

See all projects funded under this funding scheme

Call for proposal

(opens in new window) HORIZON-JU-Chips-2024-1-IA

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Coordinator

INFINEON TECHNOLOGIES AG
Net EU contribution
€ 2 519 325,75
Address
AM CAMPEON 1-15
85579 Neubiberg
Germany
Region
Bayern Oberbayern München, Landkreis
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost
€ 12 596 628,75

Participants (61)

Partners (1)