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300 mm Silicon Service Centre

Objectif

The European semiconductor equipment industry - mostly SMEs - is facing the transition to 300 mm processing, which has been delayed worldwide and is only now really starting. The objective of the project is to offer a structure to the equipment suppliers that provides low cost 300 mm silicon wafer services for Proof of Concept Tests under SEA mainly at supplier sites (similar to wafer, analytical and metrology support offered in SEA 300 under Esprit). As there is no single site existing to provide such support, 300SiSC will co-ordinate such services from wherever they can be received at the required quality and at competitive costs. Taking advantage of their experience in 300 mm processing, 300SiSC will co-ordinate its work with dissemination activities for assessment take-up measures under IST in FP5 (project IST-11025, SEAD).

Appel à propositions

Data not available

Coordinateur

CENTRE COMMUN DE MICROELECTRONIQUE DE CROLLES
Contribution de l’UE
Aucune donnée
Adresse
ZI DU PRE ROUX
38190 CROLLES
France

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Coût total
Aucune donnée