Deliverables Documents, reports (5) D6.1.3 Update of project dissemination and communication plan D6.1.5 Intl Workshop on smart power technology and applications D6.3.2 Impact paper on relevant standards D6.1.4 Final dissemination and communication report D6.1.2 Project dissemination and communication plan Websites, patent fillings, videos etc. (1) D6.1.1 Project website online Publications Peer reviewed articles (4) A Fully Programmable eFPGA-Augmented SoC for Smart Power Applications Author(s): Francesco Renzini, Claudio Mucci, Davide Rossi, Eleonora Franchi Scarselli, Roberto Canegallo Published in: IEEE Transactions on Circuits and Systems I: Regular Papers, Issue 67/2, 2020, Page(s) 489-501, ISSN 1549-8328 Publisher: Institute of Electrical and Electronics Engineers DOI: 10.1109/tcsi.2019.2930412 Hot-Carrier Degradation in Power LDMOS: Drain Bias Dependence and Lifetime Evaluation Author(s): Andrea Natale Tallarico, Susanna Reggiani, Riccardo Depetro, Stefano Manzini, Andrea Mario Torti, Giuseppe Croce, Enrico Sangiorgi, Claudio Fiegna Published in: IEEE Transactions on Electron Devices, Issue 65/11, 2018, Page(s) 5195-5198, ISSN 0018-9383 Publisher: Institute of Electrical and Electronics Engineers DOI: 10.1109/ted.2018.2867650 TCAD investigation on hot-electron injection in new-generation technologies Author(s): S. Reggiani, M. Rossetti, A. Gnudi, A.N. Tallarico, A. Molfese, S. Manzini, R. Depetro, G. Croce, E. Sangiorgi, C. Fiegna Published in: Microelectronics Reliability, Issue 88-90, 2018, Page(s) 1090-1093, ISSN 0026-2714 Publisher: Elsevier BV DOI: 10.1016/j.microrel.2018.07.097 Understanding the impact of split-gate LDMOS transistors: Analysis of performance and hot-carrier-induced degradation Author(s): Paolo Magnone; Andrea Natale Tallarico; Simone Pistollato; Riccardo Depetro; Giuseppe Croce Published in: Solid-State Electronics, Issue 108068, 2021, ISSN 0038-1101 Publisher: Pergamon Press Ltd. DOI: 10.1016/j.sse.2021.108068 Conference proceedings (9) Direct SPICE-like 3-D Electrothermal Simulation of Power HEMTs Author(s): L. Cernaj, A. Chvala, J. Marek, D. Donova, T. Zavodnik, J. Kozarik, M. Jagelka, M. Donoval Published in: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4, ISBN 978-1-5386-7490-1 Publisher: IEEE DOI: 10.1109/ASDAM.2018.8544582 Advanced TCAD Simulation of Silver Sintering for Power Modules Integration Author(s): P. Pribitny, A. Chvala, J. Marek, D. Donoval Published in: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4, ISBN 978-1-5386-7490-1 Publisher: IEEE DOI: 10.1109/ASDAM.2018.8544562 Methodology and More Accurate Electrothermal Model for Fast Simulation of Power HEMTs Author(s): Aleš Chvála, Juraj Marek, Luboš Černaj, Patrik Príbytný, Alexander Šatka, Steve Stoffels, Niels Posthuma, Stefaan Decoutere, Daniel Donoval Published in: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2018, ISBN 978-3-8007-4646-0 Publisher: VDE European Activity for Smart Power Electronics and Power Discretes – The R3-PowerUP EU Project Author(s): T. Bieniek, G. Janczyk Published in: TechConnect Briefs, Issue 4, 2018, Page(s) 63 - 66, ISBN 978-0-9988782-1-8 Publisher: TechConnect Briefs The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines Author(s): T. Bieniek, G. Janczyk Published in: TechConnect Briefs, Issue 4, 2018, Page(s) 59 - 62, ISBN 978-0-9988782-1-8 Publisher: TechConnect Briefs 3D Electrothermal Device/Circuit Simulation of Multifinger Power HEMTs Author(s): Ľ. Černaj, A. Chvála, J. Marek, D. Donoval, T. Závodník, J. Kozárik, M. Jagelka, M. Donoval Published in: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Page(s) 73-76, ISBN 978-80-554-1450-8 Publisher: Institute of Electronics and Photonics, FEI STU in Bratislava TCAD Simulation Mmethodology for 3-D Electro-Physical and Advanced Thermal Analysis of Power Modules Author(s): P. Pribytny, A. Chvala, J. Marek, D. Donoval Published in: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Page(s) 164-167, ISBN 978-80-554-1450-8 Publisher: Institute of Electronics and Photonics, FEI STU in Bratislava Analysis and optimization of power module supported by new TCAD simulation methodology for 3-D electro-physical and advanced thermal analysis Author(s): P. Pribytny, A. Chvala, J. Marek and D. Donoval Published in: Advances in Electronic and Photonic Technologies - ADEPT 2020, 2020 Publisher: Faculty of Electrical Engineering and Information Technology, Slovak University of Technology, Bratislava Full Understanding of Hot Electrons and Hot/Cold Holes in the Degradation of p-channel Power LDMOS Transistors Author(s): Andrea Natale Tallarico; Susanna Reggiani; Riccardo Depetro; Giuseppe Croce; Enrico Sangiorgi; Claudio Fiegna Published in: IRPS, Issue 5, 2020 Publisher: IEEE DOI: 10.1109/irps45951.2020.9129112 Intellectual Property Rights Patent (2) COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES Application/Publication number: 20 843595 Date: 2020-07-20 Applicant(s): ICOS VISION SYSTEMS NV COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES Application/Publication number: 20 843595 Date: 2020-07-20 Applicant(s): ICOS VISION SYSTEMS NV Searching for OpenAIRE data... 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