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300mm Pilot Line for Smart Power and Power Discretes

Deliverables

D6.1.3

Update of project dissemination and communication plan

D6.1.2

Project dissemination and communication plan

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Publications

Hot-Carrier Degradation in Power LDMOS: Drain Bias Dependence and Lifetime Evaluation

Author(s): Andrea Natale Tallarico, Susanna Reggiani, Riccardo Depetro, Stefano Manzini, Andrea Mario Torti, Giuseppe Croce, Enrico Sangiorgi, Claudio Fiegna
Published in: IEEE Transactions on Electron Devices, Issue 65/11, 2018, Page(s) 5195-5198, ISSN 0018-9383
DOI: 10.1109/ted.2018.2867650

TCAD investigation on hot-electron injection in new-generation technologies

Author(s): S. Reggiani, M. Rossetti, A. Gnudi, A.N. Tallarico, A. Molfese, S. Manzini, R. Depetro, G. Croce, E. Sangiorgi, C. Fiegna
Published in: Microelectronics Reliability, Issue 88-90, 2018, Page(s) 1090-1093, ISSN 0026-2714
DOI: 10.1016/j.microrel.2018.07.097

Direct SPICE-like 3-D Electrothermal Simulation of Power HEMTs

Author(s): L. Cernaj, A. Chvala, J. Marek, D. Donova, T. Zavodnik, J. Kozarik, M. Jagelka, M. Donoval
Published in: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4
DOI: 10.1109/ASDAM.2018.8544582

Advanced TCAD Simulation of Silver Sintering for Power Modules Integration

Author(s): P. Pribitny, A. Chvala, J. Marek, D. Donoval
Published in: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4
DOI: 10.1109/ASDAM.2018.8544562

Methodology and More Accurate Electrothermal Model for Fast Simulation of Power HEMTs

Author(s): Aleš Chvála, Juraj Marek, Luboš Černaj, Patrik Príbytný, Alexander Šatka, Steve Stoffels, Niels Posthuma, Stefaan Decoutere, Daniel Donoval
Published in: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2018

European Activity for Smart Power Electronics and Power Discretes – The R3-PowerUP EU Project

Author(s): T. Bieniek, G. Janczyk
Published in: TechConnect Briefs, Issue 4, 2018, Page(s) 63 - 66

The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines

Author(s): T. Bieniek, G. Janczyk
Published in: TechConnect Briefs, Issue 4, 2018, Page(s) 59 - 62

3D Electrothermal Device/Circuit Simulation of Multifinger Power HEMTs

Author(s): Ľ. Černaj, A. Chvála, J. Marek, D. Donoval, T. Závodník, J. Kozárik, M. Jagelka, M. Donoval
Published in: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Page(s) 73-76

TCAD Simulation Mmethodology for 3-D Electro-Physical and Advanced Thermal Analysis of Power Modules

Author(s): P. Pribytny, A. Chvala, J. Marek, D. Donoval
Published in: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Page(s) 164-167