300mm Pilot Line for Smart Power and Power Discretes

Project Information

R3-PowerUP

Grant agreement ID: 737417

DOI

10.3030/737417

Project closed

EC signature date 15 May 2017

Start date 1 November 2017

End date 30 April 2023

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Total cost

€ 180 318 047,50

EU contribution

€ 28 046 206,50

Coordinated by

STMICROELECTRONICS SRL
Italy

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Documents, reports (5)

D6.1.3

Update of project dissemination and communication plan

D6.1.5

Intl Workshop on smart power technology and applications

D6.3.2

Impact paper on relevant standards

D6.1.4

Final dissemination and communication report

D6.1.2

Project dissemination and communication plan

Websites, patent fillings, videos etc. (1)

D6.1.1

Project website online

Publications

Peer reviewed articles (4)

A Fully Programmable eFPGA-Augmented SoC for Smart Power Applications

Author(s): Francesco Renzini, Claudio Mucci, Davide Rossi, Eleonora Franchi Scarselli, Roberto Canegallo
Published in: IEEE Transactions on Circuits and Systems I: Regular Papers, Issue 67/2, 2020, Page(s) 489-501, ISSN 1549-8328
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tcsi.2019.2930412

Hot-Carrier Degradation in Power LDMOS: Drain Bias Dependence and Lifetime Evaluation

Author(s): Andrea Natale Tallarico, Susanna Reggiani, Riccardo Depetro, Stefano Manzini, Andrea Mario Torti, Giuseppe Croce, Enrico Sangiorgi, Claudio Fiegna
Published in: IEEE Transactions on Electron Devices, Issue 65/11, 2018, Page(s) 5195-5198, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2018.2867650

TCAD investigation on hot-electron injection in new-generation technologies

Author(s): S. Reggiani, M. Rossetti, A. Gnudi, A.N. Tallarico, A. Molfese, S. Manzini, R. Depetro, G. Croce, E. Sangiorgi, C. Fiegna
Published in: Microelectronics Reliability, Issue 88-90, 2018, Page(s) 1090-1093, ISSN 0026-2714
Publisher: Elsevier BV
DOI: 10.1016/j.microrel.2018.07.097

Understanding the impact of split-gate LDMOS transistors: Analysis of performance and hot-carrier-induced degradation

Author(s): Paolo Magnone; Andrea Natale Tallarico; Simone Pistollato; Riccardo Depetro; Giuseppe Croce
Published in: Solid-State Electronics, Issue 108068, 2021, ISSN 0038-1101
Publisher: Pergamon Press Ltd.
DOI: 10.1016/j.sse.2021.108068

Conference proceedings (9)

Direct SPICE-like 3-D Electrothermal Simulation of Power HEMTs

Author(s): L. Cernaj, A. Chvala, J. Marek, D. Donova, T. Zavodnik, J. Kozarik, M. Jagelka, M. Donoval
Published in: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4, ISBN 978-1-5386-7490-1
Publisher: IEEE
DOI: 10.1109/ASDAM.2018.8544582

Advanced TCAD Simulation of Silver Sintering for Power Modules Integration

Author(s): P. Pribitny, A. Chvala, J. Marek, D. Donoval
Published in: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Page(s) 1-4, ISBN 978-1-5386-7490-1
Publisher: IEEE
DOI: 10.1109/ASDAM.2018.8544562

Methodology and More Accurate Electrothermal Model for Fast Simulation of Power HEMTs

Author(s): Aleš Chvála, Juraj Marek, Luboš Černaj, Patrik Príbytný, Alexander Šatka, Steve Stoffels, Niels Posthuma, Stefaan Decoutere, Daniel Donoval
Published in: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2018, ISBN 978-3-8007-4646-0
Publisher: VDE

European Activity for Smart Power Electronics and Power Discretes – The R3-PowerUP EU Project

Author(s): T. Bieniek, G. Janczyk
Published in: TechConnect Briefs, Issue 4, 2018, Page(s) 63 - 66, ISBN 978-0-9988782-1-8
Publisher: TechConnect Briefs

The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines

Author(s): T. Bieniek, G. Janczyk
Published in: TechConnect Briefs, Issue 4, 2018, Page(s) 59 - 62, ISBN 978-0-9988782-1-8
Publisher: TechConnect Briefs

3D Electrothermal Device/Circuit Simulation of Multifinger Power HEMTs

Author(s): Ľ. Černaj, A. Chvála, J. Marek, D. Donoval, T. Závodník, J. Kozárik, M. Jagelka, M. Donoval
Published in: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Page(s) 73-76, ISBN 978-80-554-1450-8
Publisher: Institute of Electronics and Photonics, FEI STU in Bratislava

TCAD Simulation Mmethodology for 3-D Electro-Physical and Advanced Thermal Analysis of Power Modules

Author(s): P. Pribytny, A. Chvala, J. Marek, D. Donoval
Published in: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Page(s) 164-167, ISBN 978-80-554-1450-8
Publisher: Institute of Electronics and Photonics, FEI STU in Bratislava

Analysis and optimization of power module supported by new TCAD simulation methodology for 3-D electro-physical and advanced thermal analysis

Author(s): P. Pribytny, A. Chvala, J. Marek and D. Donoval
Published in: Advances in Electronic and Photonic Technologies - ADEPT 2020, 2020
Publisher: Faculty of Electrical Engineering and Information Technology, Slovak University of Technology, Bratislava

Full Understanding of Hot Electrons and Hot/Cold Holes in the Degradation of p-channel Power LDMOS Transistors

Author(s): Andrea Natale Tallarico; Susanna Reggiani; Riccardo Depetro; Giuseppe Croce; Enrico Sangiorgi; Claudio Fiegna
Published in: IRPS, Issue 5, 2020
Publisher: IEEE
DOI: 10.1109/irps45951.2020.9129112

Intellectual Property Rights

Patent (2)

COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES

Application/Publication number: 20 843595
Date: 2020-07-20
Applicant(s): ICOS VISION SYSTEMS NV

COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES

Application/Publication number: 20 843595
Date: 2020-07-20
Applicant(s): ICOS VISION SYSTEMS NV