300mm Pilot Line for Smart Power and Power Discretes

Resultado final

D6.1.3

Update of project dissemination and communication plan

D6.1.5

Intl Workshop on smart power technology and applications

D6.3.2

Impact paper on relevant standards

D6.1.4

Final dissemination and communication report

D6.1.2

Project dissemination and communication plan

D6.1.1

Project website online

Publicaciones

A Fully Programmable eFPGA-Augmented SoC for Smart Power Applications

Autores: Francesco Renzini, Claudio Mucci, Davide Rossi, Eleonora Franchi Scarselli, Roberto Canegallo
Publicado en: IEEE Transactions on Circuits and Systems I: Regular Papers, Edición 67/2, 2020, Página(s) 489-501, ISSN 1549-8328
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tcsi.2019.2930412

Hot-Carrier Degradation in Power LDMOS: Drain Bias Dependence and Lifetime Evaluation

Autores: Andrea Natale Tallarico, Susanna Reggiani, Riccardo Depetro, Stefano Manzini, Andrea Mario Torti, Giuseppe Croce, Enrico Sangiorgi, Claudio Fiegna
Publicado en: IEEE Transactions on Electron Devices, Edición 65/11, 2018, Página(s) 5195-5198, ISSN 0018-9383
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2018.2867650

TCAD investigation on hot-electron injection in new-generation technologies

Autores: S. Reggiani, M. Rossetti, A. Gnudi, A.N. Tallarico, A. Molfese, S. Manzini, R. Depetro, G. Croce, E. Sangiorgi, C. Fiegna
Publicado en: Microelectronics Reliability, Edición 88-90, 2018, Página(s) 1090-1093, ISSN 0026-2714
Editor: Elsevier BV
DOI: 10.1016/j.microrel.2018.07.097

Understanding the impact of split-gate LDMOS transistors: Analysis of performance and hot-carrier-induced degradation

Autores: Paolo Magnone; Andrea Natale Tallarico; Simone Pistollato; Riccardo Depetro; Giuseppe Croce
Publicado en: Solid-State Electronics, Edición 108068, 2021, ISSN 0038-1101
Editor: Pergamon Press Ltd.
DOI: 10.1016/j.sse.2021.108068

Direct SPICE-like 3-D Electrothermal Simulation of Power HEMTs

Autores: L. Cernaj, A. Chvala, J. Marek, D. Donova, T. Zavodnik, J. Kozarik, M. Jagelka, M. Donoval
Publicado en: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Página(s) 1-4, ISBN 978-1-5386-7490-1
Editor: IEEE
DOI: 10.1109/ASDAM.2018.8544582

Advanced TCAD Simulation of Silver Sintering for Power Modules Integration

Autores: P. Pribitny, A. Chvala, J. Marek, D. Donoval
Publicado en: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2018, Página(s) 1-4, ISBN 978-1-5386-7490-1
Editor: IEEE
DOI: 10.1109/ASDAM.2018.8544562

Methodology and More Accurate Electrothermal Model for Fast Simulation of Power HEMTs

Autores: Aleš Chvála, Juraj Marek, Luboš Černaj, Patrik Príbytný, Alexander Šatka, Steve Stoffels, Niels Posthuma, Stefaan Decoutere, Daniel Donoval
Publicado en: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2018, ISBN 978-3-8007-4646-0
Editor: VDE

European Activity for Smart Power Electronics and Power Discretes – The R3-PowerUP EU Project

Autores: T. Bieniek, G. Janczyk
Publicado en: TechConnect Briefs, Edición 4, 2018, Página(s) 63 - 66, ISBN 978-0-9988782-1-8
Editor: TechConnect Briefs

The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines

Autores: T. Bieniek, G. Janczyk
Publicado en: TechConnect Briefs, Edición 4, 2018, Página(s) 59 - 62, ISBN 978-0-9988782-1-8
Editor: TechConnect Briefs

3D Electrothermal Device/Circuit Simulation of Multifinger Power HEMTs

Autores: Ľ. Černaj, A. Chvála, J. Marek, D. Donoval, T. Závodník, J. Kozárik, M. Jagelka, M. Donoval
Publicado en: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Página(s) 73-76, ISBN 978-80-554-1450-8
Editor: Institute of Electronics and Photonics, FEI STU in Bratislava

TCAD Simulation Mmethodology for 3-D Electro-Physical and Advanced Thermal Analysis of Power Modules

Autores: P. Pribytny, A. Chvala, J. Marek, D. Donoval
Publicado en: Advances in Electronic and Photonic Technologies - ADEPT 2018, 2018, Página(s) 164-167, ISBN 978-80-554-1450-8
Editor: Institute of Electronics and Photonics, FEI STU in Bratislava

Analysis and optimization of power module supported by new TCAD simulation methodology for 3-D electro-physical and advanced thermal analysis

Autores: P. Pribytny, A. Chvala, J. Marek and D. Donoval
Publicado en: Advances in Electronic and Photonic Technologies - ADEPT 2020, 2020
Editor: Faculty of Electrical Engineering and Information Technology, Slovak University of Technology, Bratislava

Full Understanding of Hot Electrons and Hot/Cold Holes in the Degradation of p-channel Power LDMOS Transistors

Autores: Andrea Natale Tallarico; Susanna Reggiani; Riccardo Depetro; Giuseppe Croce; Enrico Sangiorgi; Claudio Fiegna
Publicado en: IRPS, Edición 5, 2020
Editor: IEEE
DOI: 10.1109/irps45951.2020.9129112

Derechos de propiedad intelectual

COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES

Número de solicitud/publicación: 20 843595
Fecha: 2020-07-20
Solicitante(s): ICOS VISION SYSTEMS NV

COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES

Número de solicitud/publicación: 20 843595
Fecha: 2020-07-20
Solicitante(s): ICOS VISION SYSTEMS NV

Resultado final

Publicaciones

Derechos de propiedad intelectual

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