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FlexPAET consortium reviews technology developments achieved at the third general meeting

The project is developing an industrial process to manufacture micro structured light guides, a technology to allow enhancing the use of LEDs as source of light

4 May 2010
 
The thirteen European partners making part of FlexPAET consortium, including technology centers, universities and companies, will meet these Tuesday and Wednesday, May 4th and 5th, to review the results achieved after 20 months of activities.

Taking place in Copenhagen, Denmark, the event will be hosted by the partner IPU, leader of the work pack related to the development of mould making technologies.

Acronym for Flexible Patterning of Complex Micro Structures using Adaptive Embossing Technology, FlexPAET is an R&D project supported by the European Union that investigates manufacturing technologies in the field of micro optical systems.

The further development of light-emitting diodes (LEDs) has led to efficient, resource-saving light sources during the last years. However, its use has so far been limited to few applications, although the advantages with regard to energy-efficiency and durability are well known.

In this context, the project main goal is to develop a manufacturing process to produce cost-effective flat optics. Such elements features micro patterns –geometric structures that allow an efficient distribution of light rays, reason why it is expected to pave the way for a new class of cheaper, energy saving products using LEDs.

CHALLENGES

The production of large-area components with micro structured surfaces confronts industrial production processes with so far irresolvable problems. Flexible micro structuring with step and repeat hot embossing processes provides the opportunity to eliminate the production-related deficits of previous processes.

FlexPAET will develop an adaptive hot embossing process and integrate the technology in a process chain of a cost-effective production of planar lighting optics.

The main focus of the research project is put on the development of a machine system which imprints systematically the structure of complex micro tools into a thermoplastic component.

In contrast to the conventional process of hot embossing, singular structural elements are put together piece by piece on one surface. In surfaces up to 1x2 m² the machine can imprint microstructures with a positioning accuracy of 2 µm. Concerning flexibility and speed unknown opportunities with regard to the production of visual functionalised surfaces result.

OTHER INNOVATIONS

The optical function of the embossed component is measured directly in the machine system by means of integrated metrology. Thus errors in the optical design can be detected directly on the machine.

An algorithm compares the optical function of the embossed component with the required values. In this manner, the system identifies those positions on the surface where the structure has to be improved. The optimisation process will be proceeded until the measured optical properties correspond to the required specifications.

The process is part of a replication process chain that fits to mass-production. Similar to the approach of CD and DVD production, form tools will be produced out of the embossed component by means of galvanic electroforming processes, enabling the cost efficient production of high quality optics.

CREDITS

FlexPAET took off in October 2008 and it will run for 3 years. The activities are partially funded by the European Union, under the Seventh Framework Programme.

The consortium is coordinated by Fraunhofer IPT (Germany) and it is formed by 12 other partners: Ascamm (Spain), CEA (France), Datapixel (Spain), Eitzenberger (Germany), Gaggione (France), IMT (Romania), Innovalia (Spain), IPU (Denmark), JFA (Germany), Modines (Finland), Temicon (Germany), Zumtobel (Austria).
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