'European Microelectronics and Packaging Conference', Grenoble, France
9 September 2013 - 9 September 2013
France
The 'European Microelectronics and Packaging Conference' will be held from 9 to 12 September 2013 in Grenoble, France.
Co-sponsored by IMAPS-Europe and IEEE-CPMT, EMPC is a major event dedicated to electronics packaging, interconnection and integration. This biennial event attracts over 350 industry delegates worldwide and provides an excellent opportunity for getting familiar with the latest materials, equipment and services in the Microelectronics Industry.
The conference will include courses and tutorials, workshops and an exhibition with over 40 company stands.For further information, please visit:
http://www.empc2013.com/(opens in new window)
Co-sponsored by IMAPS-Europe and IEEE-CPMT, EMPC is a major event dedicated to electronics packaging, interconnection and integration. This biennial event attracts over 350 industry delegates worldwide and provides an excellent opportunity for getting familiar with the latest materials, equipment and services in the Microelectronics Industry.
The conference will include courses and tutorials, workshops and an exhibition with over 40 company stands.For further information, please visit:
http://www.empc2013.com/(opens in new window)