Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)

R&I should enhance the functionality, efficiency, and integration of photonic devices and circuits with a focus extended system performance. Action should address at least two of the following aspects.

• Enhanced performance through improved spectral purity, wavelength coverage, output power and noise characteristics.
• Increased modulation or detection speeds going beyond the capability of existing PIC material platforms, improved signal-processing capabilities, and integration of novel materials such as thin-film LiNbO3, BTO, graphene, silicon carbide, phase change materials and TMDCs.
• Miniaturised, high-complexity photonic circuits (e.g. multilayer photonics, chiplets, multiple integrated functional elements), scalable interconnects and electronics-photonics integration (co-packaged, heterogeneous, or monolithic) to improve performance, reliability, and cost-efficiency.
• Reduction of power consumption for example through improved electrical-to-optical conversion, lower optical losses, devices operable at higher temperatures to reduce cooling needs, and low-power circuit actuation and control.

Proposals should consider system-level impact and demonstrate advancements in representative configurations relevant to one or more application domains.

This topic implements the co-programmed European Partnership on photonics.