Objetivo
The aim of this project is to gather and disseminate information related to Systems Integration and System in a Package for various types of technologies including Semiconductor, MEMs, Nano- Bio- etc. in a variety of mass-market applications of importance to European industry.
The project also plans to assess how technologies are developing to address High Temperature and Harsh Environments as seen in Auto, Aero and other applications. The project office will be run by IMEC who will also maintain the Network membership, web site and publish newsletters twice a year. A Conference will be organised once during the two-year project and specialist workshops will be held in various European locations.
The project also intends to be actively involved in standards drafting, especially for IEC standards, through IEC/PT62258 and other standards committees as appropriate. The project will maintain links with other organisations worldwide, to both promote the Network and to gather information from other organisations, and will promote the services offered by SMEs to this industry through a User Club.