Novel electroactive polymeric materials for dielectric elastomers actuators and soft robots

Información del proyecto

EPOMA DESO

Identificador del acuerdo de subvención: 101067060

DOI

10.3030/101067060

Proyecto finalizado el 4 Febrero 2025

Fecha de la firma de la CE 13 Junio 2022

Fecha de inicio 1 Septiembre 2022

Fecha de finalización 28 Febrero 2025

Financiado con arreglo a

• Marie Skłodowska-Curie Actions (MSCA)

Coste total

Sin datos

Aportación de la UE

€ 181 152,96

Coordinado por

UNIVERSIDAD DE SANTIAGO DE COMPOSTELA
Spain

Periodic Reporting for period 1 - EPOMA DESO (Novel electroactive polymeric materials for dielectric elastomers actuators and soft robots)

Período documentado: 2022-09-01 hasta 2025-02-28

Resumen del contexto y de los objetivos generales del proyecto

In this project (EPOMA DESO), the basic idea was to utilize an electroactive polymer (EAPs), which are a class of smart materials that exhibit mechanical deformation in response to electrical stimulation, making them highly suitable for applications in haptic devices. EAP-based haptic devices offer advantages such as low power consumption, lightweight structures, and the ability to produce a wide range of force and motion outputs. They can also be used in touch-sensitive interfaces and enhancing user experience by providing lifelike touch sensations. This project was aimed to extend existing research knowledge on self-healing materials and actuator structure to create a prototype of highly stretchable, soft and self-healing haptic skins for wearable devices to create haptic interfaces.

Trabajo realizado desde el comienzo del proyecto hasta el final del período abarcado por el informe y los principales resultados hasta la fecha

This project aims to tackle the currently inherent limitations of soft haptic actuators via challenging approaches, which correspond to specific project objectives.
O1. Fabrication of biphasic polymer-liquid metal hybrid system that self-stiffens by mechanical straining- Here, the polymer (PDMS and Ecoflex) was mixed with liquid metal (Eutectic Gallium-Indium (EGaIn)) to understand the behavior of the stiffness of the composite.
• Objective 1 was partly achieved due to lack of resources for the characterizations of the samples at the working place.

O2. Development of soft, high-k dielectric elastomer composite via incorporating high dielectric constant liquid to increase the mechanical actuation strain- In this objective, the ionic liquid was mixed with the PDMS and Ecoflex to examine the behavior of the composite based on soft and high-k (ionic liquid) material.
• Objective 2 was partly achieved due to lack of resources for the characterizations of the samples at the working place.

O3. Development of the low-temperature self-healable polymeric composite systems- Herein, a new healable polymer (H-PDMS) was synthesized and was utilized for fabrication of healable electrodes with spray coating silver nanofibers as well as fabrication of electroluminescent devices. Furthermore, H-PDMS was utilized for 3D printing application.
• Objective 3 was fully achieved, and even more was done taking in an account of objective 3 (like, electroluminescent devices and 3D printing technology)

Besides, the work performed and achievements, I have set up a new research line at host institute (CiQUS) on soft materials for flexible electronics. This was totally new field of research that I have started there.

Avances que van más allá del estado de la técnica e impacto potencial esperado (incluida la repercusión socioeconómica y las implicaciones sociales más amplias del proyecto hasta la fecha)

Herein, a new healable polymer (H-PDMS) was synthesized and was utilized for fabrication of healable electrodes with spray coating silver nanofibers as well as fabrication of electroluminescent devices. Furthermore, H-PDMS was utilized for 3D printing application and devices (like, electroluminescent devices).

I have attached the publications in the publications section for the reference. One publication is in the pipeline on self-healing polymers for flexible electronics.