Advance co-packaged optics enabling high-efficiency cloud computing

Informations projet

ADOPTION

N° de convention de subvention: 101070178

DOI

10.3030/101070178

Date de signature de la CE 7 Decembre 2022

Date de début 1 Janvier 2023

Date de fin 31 Decembre 2026

Financé au titre de

• Digital, Industry and Space

Coût total

€ 6 364 026,25

Contribution de l’UE

€ 5 551 282,50

Coordonné par

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland

Periodic Reporting for period 2 - ADOPTION (Advance co-packaged optics enabling high-efficiency cloud computing)

Période du rapport: 2024-07-01 au 2026-02-28

Résumé du contexte et des objectifs généraux du projet

Hyperscale data centres and AI computing clusters are becoming central to Europe’s digital infrastructure, supporting cloud computing, artificial intelligence, social media, IoT, high-performance computing and data-intensive services. These systems require ever-increasing bandwidth between processors, memory, storage and networking equipment, while also facing strong pressure to reduce energy consumption, cost and latency. Conventional face-plate pluggable optical transceivers have supported the growth of data-centre networks, but they become increasingly challenging as switch capacity, bandwidth density and power-efficiency requirements continue to rise. ADOPTION addresses these challenges by developing advanced co-packaged optics technologies for future high-efficiency cloud and AI computing infrastructure. The project brings together European expertise in silicon photonics, electronic integrated circuits, external laser sources, optical switching, fibre coupling, packaging, system integration and high-speed testing. The overall objective is to move optical interconnects closer to the electronic switching and processing functions, reducing electrical interconnect bottlenecks and enabling more scalable, energy-efficient network architectures.

The project focuses on three main technical objectives: disruptive optical switching architectures for low-latency and high-capacity data-centre and AI-cluster networks; advanced 2.5D and 3D co-packaging of photonic and electronic chips; and dense wavelength-division multiplexed photonic transceiver engines for co-packaged optics. Together, these developments aim to increase bandwidth density, reduce energy per bit, support modular optical network architectures and strengthen the European technology base for next-generation optical interconnects. By combining component innovation with packaging, control and system-level validation, ADOPTION aims to support a more open and modular European ecosystem for co-packaged optics. The expected impact is not limited to individual devices, but includes improved routes towards manufacturable subsystems, interoperability, standardisation and future exploitation by European research organisations, SMEs and industrial partners.

Travail effectué depuis le début du projet jusqu’à la fin de la période considérée dans le rapport et principaux résultats atteints jusqu’à présent

During the second reporting period, ADOPTION progressed from component design and early fabrication towards subsystem validation, packaging definition and demonstrator preparation. The project continued development of the silicon photonic transceiver engine, high-speed electronic driver and receiver circuits, external laser source, optical port breakout module, wavelength-selective switching approach, fibre-coupling concepts and system-level test platforms. Important progress was made in refining the co-packaged optics demonstrator route, including the use of advanced silicon photonic PICs, low-power CMOS electronics, active monitoring and tuning concepts, and practical packaging and assembly strategies. The consortium also advanced the supporting technologies required for system validation. These include high-power multi-wavelength O-band laser sources, PLC-based AWG structures for port breakout, InP/PLC-based optical switching concepts, ultra-high-accuracy fibre-array alignment, DIPS-compatible packaging concepts, under-board optical fibre routing, and multi-channel high-speed O-band test capability. The project has also strengthened links with related European and national activities, supporting standardisation, exploitation and future demonstrator alignment. Overall, ADOPTION has maintained its focus on enabling high-efficiency optical interconnect technologies for future cloud, hyperscale data-centre and AI-cluster applications. While some technical routes have been adapted to reduce risk and improve demonstrator feasibility, the project has continued to make strong progress towards its main objectives of reducing power consumption, increasing bandwidth density and enabling a more modular European co-packaged optics ecosystem.

Progrès au-delà de l’état des connaissances et impact potentiel prévu (y compris l’impact socio-économique et les conséquences sociétales plus larges du projet jusqu’à présent)

By the end of the second reporting period, ADOPTION had advanced beyond initial component design and fabrication towards integrated subsystem validation and demonstrator preparation. The project has generated results beyond the state of the art in several linked areas: dense O-band DWDM transceiver concepts for co-packaged optics, low-power electronic driver and receiver design, high-power multi-wavelength external laser sources, optical port breakout and wavelength-selective switching architectures, active fibre-alignment concepts, and modular packaging approaches compatible with future data-centre optical interconnects. These results support a more modular European co-packaged optics ecosystem, in which photonic integrated circuits, electronic ICs, laser sources, optical switching/routing elements, fibre-coupling solutions and test platforms can be developed and optimised by specialist partners. This is important both technically and commercially, because it reduces dependence on vertically integrated non-European supply chains and creates clearer exploitation routes for European research organisations, SMEs and industrial partners. The main needs for further uptake are continued subsystem integration, experimental demonstration under realistic high-speed operating conditions, protection and management of intellectual property, and alignment with emerging standards and packaging practices. Continued engagement with data-centre, AI-computing, optical interconnect and standardisation communities will be important to translate the project results into future products, services and follow-on research or commercial activities.