Periodic Reporting for period 2 - PetVision (Next generation Limited-Angle time-of-flight PET imager)
Reporting period: 2024-09-01 to 2025-12-31
Project coordination and follow-up were ensured through the regular operation of the Steering Board and Project Management Team. Consortium meetings and technical coordination meetings were organised, enabling alignment across work packages. Administrative activities included the preparation and submission of periodic reports, deliverables, and formal requests for Grant Agreement amendments.
Main achievements:
Efficient coordination ensured timely progress across all technical WPs. The amendment process was successfully managed, allowing refinement of the technical scope and schedule while preserving the original project objectives.
WP2 – System Design
Medical and technical system requirements defined in RP1 were further consolidated and used as a reference for ongoing developments. Extensive evaluation of scintillator crystal samples from multiple producers, FBK SiPM sensor samples, and the FastIC/FastIC+ ASICs was performed. Single-pixel detector performance studies confirmed the feasibility of the targeted timing and integration concepts. Large-scale simulation and reconstruction studies continued, addressing system geometry, performance trade-offs, and reconstruction strategies. Work on the prototype technical design report was initiated, with mechanical design activities progressing well.
Main achievements:
Feasibility of the planned detector and system concepts was confirmed experimentally and through simulations. Simulation results led to peer-reviewed publications, strengthening the scientific basis of the project. The prototype technical design entered a mature phase, with mechanical layouts largely defined.
WP3 – ASIC Development
Extensive simulation and experimental studies of individual ASIC building blocks were carried out to validate key functional elements. Multiple floorplan and BGA integration options were explored to optimise performance, scalability, and packaging constraints. Preparatory work for final ASIC design choices continued, laying the groundwork for subsequent fabrication and characterisation phases.
Main achievements:
Critical ASIC building blocks were validated at the component level, and viable integration strategies were identified. The work significantly reduced technical risk for the forthcoming integrated ASIC prototype.
WP4 – Development of Integrated Photosensor
Test structures for next-generation SiPM arrays were produced to explore advanced sensor concepts and integration options. The first production run of next-generation SiPM arrays is underway. Preparatory activities for photo-detection module development were aligned with ongoing sensor and ASIC integration efforts.
Main achievements:
Key design choices for next-generation SiPM arrays were finalised, and fabrication entered the second learning phase. This represents a critical step toward integrated detector modules.
WP5 – Front-End Readout and DAQ
Activities performed (RP2):
The design of concentrator and synchronisation boards progressed significantly, with component selection nearing completion. The conceptual and architectural design of the data acquisition system is under way, ensuring compatibility with the evolving ASIC and detector module designs.
Main achievements:
A coherent front-end and DAQ architecture was defined, providing a clear path toward integrated readout and system-level validation in subsequent phases.
WP6 – Production and Integration
Production of the mechanical components for the demonstrator progressed significantly and is now close to completion. Initial testing of the manufactured mechanical parts is underway to verify tolerances, stability, and integration interfaces. In parallel, the cooling system was designed to meet the thermal requirements of the detector modules and front-end electronics. Finalisation and experimental validation of the cooling solution are planned once the photo-detection module (PDM) prototypes become available.
Main achievements:
Mechanical production for the demonstrator reached an advanced stage, enabling imminent system integration. A complete cooling system design was defined, providing a clear and low-risk path toward thermal validation at the module and system levels in the next phase.
WP7 – Preclinical and Clinical Research Evaluation
Preparatory work for prototype validation and clinical research procedures continued, incorporating changes introduced by the approved amendment. Validation strategies were refined to ensure compliance with ethical requirements and clinical protocols.
Main achievements:
A clear and ethically compliant validation pathway was established, supporting future prototype testing in relevant environments.
WP8 – Exploitation, Impact and Communication
Communication, dissemination, and outreach activities were carried out through digital channels, scientific publications, conferences, and stakeholder engagement. Exploitation activities focused on identifying exploitable results, protecting foreground IP, and refining potential exploitation routes.
Main achievements:
Project visibility and stakeholder engagement were strengthened while maintaining IP protection. A credible exploitation strategy emerged, positioning the project well for EIC Transition and future uptake.
Summary:
During RP2, the project progressed from concept definition toward validated building blocks and integrated system design. Key technological risks were reduced through experimental validation, simulations, and design refinement, while exploitation and communication activities prepared the ground for subsequent system integration and EIC Transition-oriented developments.
1. the multichannel ASIC with a fast analog front end and the time-to-digital converter with precise timing resolution and moderate power consumption. The chip design is well underway and incorporates the understanding gained during the experimental work done with single-channel high-power converters.
2. the monolithic photon sensors have increased photon detector efficiency, high fill factor and good timing properties. This has been achieved by a novel through-silicon-via process.
3. 2.5D integration of the detector and sensor. We are exploring different packaging options: e.g. partial packaging of ASIC chips in a BGA package, selection of the interposer with high flatness, integration of cooling elements in the interposer, embedded components materials.
4. The mechanical design of the prototype will be flexible, robust and compact to allow imaging of different body parts in different settings, i.e. in parallel with the existing PET scanners for comparative, non-invasive studies.