Low-power consumption, heavy-metal-free wide-spectrum image sensors for mass-market computer vision applications

Informations projet

QSTACK

N° de convention de subvention: 101113088

DOI

10.3030/101113088

Projet clôturé

Date de signature de la CE 20 Mars 2023

Date de début 1 Avril 2023

Date de fin 30 Septembre 2025

Financé au titre de

• The European Innovation Council (EIC)

Coût total

€ 2 370 937,50

Contribution de l’UE

€ 2 370 937,50

Coordonné par

QURV TECHNOLOGIES SL
Spain

Periodic Reporting for period 2 - QSTACK (Low-power consumption, heavy-metal-free wide-spectrum image sensors for mass-market computer visionapplications)

Période du rapport: 2024-04-01 au 2025-09-30

Résumé du contexte et des objectifs généraux du projet

The QSTACK project aims to revolutionize the field of image sensing by developing low-power consumption, heavy-metal-free, wide-spectrum image sensors for mass-market computer vision applications. Traditional silicon-based CMOS image sensors, while ubiquitous, are limited in their spectral range and power efficiency, making them less suitable for emerging applications in autonomous vehicles, extended reality (XR) devices, and service robots. These applications require sensors that can operate effectively under challenging visibility conditions, such as fog, low light, and adverse weather, and that can capture a broader spectrum of light, including near-infrared (NIR) and short-wave infrared (SWIR). QSTACK addresses these limitations by integrating Transition Metal Dichalcogenides (TMDC) with CMOS technology and developing a lead-free Colloidal Quantum Dot (CQD) stack. This innovative approach aims to achieve ultra-low power consumption and high sensitivity across a wide spectral range, making it ideal for power-sensitive applications in consumer electronics and automotive industries.

Travail effectué depuis le début du projet jusqu’à la fin de la période considérée dans le rapport et principaux résultats atteints jusqu’à présent

During the QSTACK project, significant advancements were made in developing low-power, heavy-metal-free, wide-spectrum image sensors for computer vision applications. In Technology Development, the project matured Silver Telluride (AgTe) and Indium Arsenide (InAs) quantum dots materials. The QSTACK process modules reached TRL 5 and were validated as compatible with multiple CMOS platforms. For Product Development, two beta prototype evaluation kits (EVKs) were delivered, enabling customer testing and validation across 21 use cases, with 10 representing entirely new applications. Commercially, the project secured seven Letters of Intent (LoIs) from key industry partners and launched an Early Adopters Program.

Progrès au-delà de l’état des connaissances et impact potentiel prévu (y compris l’impact socio-économique et les conséquences sociétales plus larges du projet jusqu’à présent)

The QSTACK project has achieved significant advancements in the development of heavy-metal-free, wide-spectrum image sensors, pushing the boundaries of current image sensor technology. Key results include the development of a lead-free colloidal quantum dot (CQD) stack process with wide-spectrum sensitivity. These advancements enable environmentally sustainable image sensors suitable for mass-market applications. The potential impacts of QSTACK include significant scientific contributions, such as the first lead-free photodetector based on silver telluride colloidal quantum dots, published in Nature Photonics, and new tools for image sensing applicable in various research fields. Economically and societally, the technology promises to create new markets and business opportunities, enhance the capabilities of autonomous systems, improve safety in automotive applications, and enable new functionalities in consumer electronics, potentially leading to job creation and economic growth. Industrially, wide-spectrum image sensors could improve the efficiency and reliability of various applications, including autonomous vehicles and drones, leading to enhanced safety, productivity, and cost savings.