In the first 18 months, the Consortium focused on two fronts: (i) building essential blocks—photonic-integrated tunable lasers, Rb MEMS vapor cells, and GaP optomechanical crystals—for quantum-enhanced sensors; and (ii) updating protocols and test setups to characterise the new devices.
For the narrow-linewidth laser and integrated squeezed-light source, work progressed along three tracks:
• Gain chip: material selection, layer doping, quantum-well design for target wavelengths, independent characterisation, and ridge-waveguide fabrication.
• SiN circuitry and coupling: design/fabrication of the TriPleX™ cavity with electrical tuning and coupling of the gain chip to SiN.
• Packaging: spot-size converters, precision alignment, and gluing to meet stringent sensor requirements.
To realise a miniaturised squeezed-light source at 780 nm, the team designed and fabricated PPLNOI waveguides, resonators, and modulators, plus mode-field converters for efficient coupling to the SiN motherboard. Simulations prompted a revision of the frequency conversion scheme, and the poling process was optimised (pulse-duration tuning).
MEMS Rb vapor cells for TPOCs and OPMs were built from two glass wafers and a silicon wafer. Silicon cavities were made by DRIE. Four cell types meet TPOC needs; each includes an Rb dispenser, getter pills to remove residual gases after bonding, and an optical cavity. OPM cells incorporate a heater that does not perturb the magnetic field.
For optomechanical crystals, the Consortium designed and fabricated GaP structures that co-confine photons and phonons. A key result is a hybrid photonic integration platform using micro-transfer printing of GaP and lithium-niobate-on-insulator (LNOI) devices onto SiN circuits.
While awaiting shipment of some building blocks, partners aligned on target parameters, validated protocols on macroscopic testbeds, and prepared the characterisation setups. With Noisy Lab, the team developed and characterised a 780-nm balanced homodyne detector with high quantum efficiency and low electronic dark noise to measure squeezing from the integrated source.
These activities establish the devices, platforms, and metrology to move optical clocks, OPMs, and optomechanical thermometers toward reproducible, chip-scale implementation.