Mechanical Impact on Non-silicon Devices: Stress Effects on Technology

Project Information

MINDSET

Grant agreement ID: 101154357

DOI

10.3030/101154357

Project closed

EC signature date 10 April 2024

Start date 1 August 2024

End date 31 July 2026

Funded under

• Marie Skłodowska-Curie Actions (MSCA)

Total cost

No data

EU contribution

€ 175 920,00

Coordinated by

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium

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Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Documents, reports (1)

Communication, Dissemination & Exploitation Plan

The plan describes the planned measures to maximize the impact of the project, including the dissemination and exploitation measures that are planned, and the target group(s) addressed. Regarding communication measures and public engagement strategy, the aim is to inform and reach out to society and show the activities performed, and the use and the benefits the project will have for citizens.

Publications

Peer reviewed articles (2)

Observation of fully recoverable leakage behaviour in HfO ₂ gate oxide of WS ₂ 2D FETs induced by local mechanical stress

Author(s): Kavita Vishwakarma, Ben Kaczer, Quentin Smets, Luca Panarella, Anastasiia Kruv, Tom Schram, Mario Gonzalez, Oguzhan Orkut Okudur, Yao Yao, Ingrid De Wolf
Published in: 2D Materials, Issue 12, 2025, ISSN 2053-1583
Publisher: IOP Publishing
DOI: 10.1088/2053-1583/AE03D4

Vertical Compressive Stress in Fab-Integrated WS2 FETs: An In Situ Electrical and Nanoindentation-Based Study

Author(s): Kavita Vishwakarma, Mario Gonzalez, Quentin Smets, Luca Panarella, Fateme Yekefalah, Tom Schram, Oguzhan Orkut Okudur, Ben Kaczer
Published in: ACS Applied Electronic Materials, 2026, ISSN 2637-6113
Publisher: American Chemical Society (ACS)
DOI: 10.1021/ACSAELM.6C00701

Conference proceedings (1)

Impact of Mechanical Stress on IGZO TFTs: Enhancing PBTI Degradation

Author(s): K. Vishwakarma, K. Lee, A. Kruv, A. Chasin, M. J. van Setten, C. Pashartis, O. O. Okudur, M. Gonzalez, N. Rassoul, A. Belmonte, B. Kaczer
Published in: 2025 IEEE International Reliability Physics Symposium (IRPS), 2025
Publisher: IEEE
DOI: 10.1109/IRPS48204.2025.10983050